Effect of lead content on vibration fracture behavior of Pb-Sn eutectic solder

C. M. Chuang, T. S. Lui, L. H. Chen

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

According to resonant vibration fatigue tests, near-eutectic and Pb-rich hypoeutectic Pb-Sn specimens have higher crack-propagation resistance. The tensile flow stress of Pb-Sn solders that are near eutectic composition increases with decreasing Pb content. The solders were tested after either stabilizing at 373 K or natural aging for 20 days, which gave similar results. The naturally aged specimens show that the crack-propagation resistance increases with increasing aging time. A striated deformation was found to occur in Sn grain of the lower Pb specimen. This phenomenon is correlated with a deterioration of crack-propagation resistance.

Original languageEnglish
Pages (from-to)2644-2652
Number of pages9
JournalJournal of Materials Research
Volume16
Issue number9
DOIs
Publication statusPublished - 2001 Feb 6

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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