TY - GEN
T1 - Effect of low Bi content on mechanical properties of Sn-Bi-Zn-In alloy and its joint with Cu
AU - Nishikawa, Hiroshi
AU - Hirata, Yuki
AU - Yang, Chih Han
AU - Lin, Shih Kang
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Low-temperature-processable interconnect materials are recently desirable for electronics. In recent years, wearable electronics have been the trend in electronic industries. Wearable devices are integrated on soft and flexible objects made with organic substances. Accordingly, the electronic assembly industry needs low-temperature bonding processes, and the demand for low-temperature lead-free solder alloys has increased significantly in the electronics industry. In this study, Sn-Bi-Zn-In alloy with low Bi content was examined by tensile tests before and after aging. Then, the applicability of Cu/Cu joints formed using Sn-Bi-Zn-In alloy was investigated. As a result, as mechanical properties of the Sn-Bi-Zn-In alloy, higher ultimate tensile strength and better elongation than the eutectic Sn-58Bi alloy were obtained. Then, the shear strengths of the Sn-Bi-Zn-In alloy joints remained unchanged after aging for 1008 h, suggesting that the alloy joint demonstrated the better long-term reliability.
AB - Low-temperature-processable interconnect materials are recently desirable for electronics. In recent years, wearable electronics have been the trend in electronic industries. Wearable devices are integrated on soft and flexible objects made with organic substances. Accordingly, the electronic assembly industry needs low-temperature bonding processes, and the demand for low-temperature lead-free solder alloys has increased significantly in the electronics industry. In this study, Sn-Bi-Zn-In alloy with low Bi content was examined by tensile tests before and after aging. Then, the applicability of Cu/Cu joints formed using Sn-Bi-Zn-In alloy was investigated. As a result, as mechanical properties of the Sn-Bi-Zn-In alloy, higher ultimate tensile strength and better elongation than the eutectic Sn-58Bi alloy were obtained. Then, the shear strengths of the Sn-Bi-Zn-In alloy joints remained unchanged after aging for 1008 h, suggesting that the alloy joint demonstrated the better long-term reliability.
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U2 - 10.1109/ESTC55720.2022.9939483
DO - 10.1109/ESTC55720.2022.9939483
M3 - Conference contribution
AN - SCOPUS:85143158680
T3 - 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings
SP - 383
EP - 386
BT - 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 9th IEEE Electronics System-Integration Technology Conference, ESTC 2022
Y2 - 13 September 2022 through 16 September 2022
ER -