Effect of low temperature on the micro-impact fracture behavior of Sn-Ag-Cu solder joint

D. S. Liu, C. L. Hsu, C. Y. Kuo, Y. L. Huang, K. L. Lin, G. S. Shen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this work, the failure characteristics of lead-free solder joint were investigated with low temperature micro-impact test. A impact testing method with shear rate of 1 m/s and temperatures ranging from room temperature to -40°C was set up to measure the interfacial strength of solder joints for evaluating the reliability. Experimental results have shown that the testing temperatures were found to have strong effects on the impact resistance and fracture mechanisms of Sn-Ag-Cu lead-free solder joint. The failure mode percentage, the peak load, and the energy to peak load under changing low temperature conditions will be presented in this paper.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
Publication statusPublished - 2010 Dec 1
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
Duration: 2010 Oct 202010 Oct 22

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan
CityTaipei
Period10-10-2010-10-22

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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