TY - GEN
T1 - Effect of low temperature on the micro-impact fracture behavior of Sn-Ag-Cu solder joint
AU - Liu, D. S.
AU - Hsu, C. L.
AU - Kuo, C. Y.
AU - Huang, Y. L.
AU - Lin, K. L.
AU - Shen, G. S.
PY - 2010
Y1 - 2010
N2 - In this work, the failure characteristics of lead-free solder joint were investigated with low temperature micro-impact test. A impact testing method with shear rate of 1 m/s and temperatures ranging from room temperature to -40°C was set up to measure the interfacial strength of solder joints for evaluating the reliability. Experimental results have shown that the testing temperatures were found to have strong effects on the impact resistance and fracture mechanisms of Sn-Ag-Cu lead-free solder joint. The failure mode percentage, the peak load, and the energy to peak load under changing low temperature conditions will be presented in this paper.
AB - In this work, the failure characteristics of lead-free solder joint were investigated with low temperature micro-impact test. A impact testing method with shear rate of 1 m/s and temperatures ranging from room temperature to -40°C was set up to measure the interfacial strength of solder joints for evaluating the reliability. Experimental results have shown that the testing temperatures were found to have strong effects on the impact resistance and fracture mechanisms of Sn-Ag-Cu lead-free solder joint. The failure mode percentage, the peak load, and the energy to peak load under changing low temperature conditions will be presented in this paper.
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U2 - 10.1109/IMPACT.2010.5699648
DO - 10.1109/IMPACT.2010.5699648
M3 - Conference contribution
AN - SCOPUS:79951628259
SN - 9781424497836
T3 - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
BT - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
T2 - 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
Y2 - 20 October 2010 through 22 October 2010
ER -