TY - GEN
T1 - Effect of orientation on the convective boiling performance of microchannel heat sink using HFE-7100
AU - Yang, Kai Shing
AU - Jeng, Yeau Ren
AU - Huang, Chun Min
AU - Wang, Chi Chuan
PY - 2009
Y1 - 2009
N2 - The present study investigates the heat transfer and pressure drop characteristics of the dielectric fluid HFE-7100 within multiport microrchannel heat sink with square microchannels having a hydraulic diameter of 790 μm subject to a tilted arrangement of 45 degree. For a mass flux of 100 or 200 kg/m2·s, it is found that the heat transfer coefficients are for the tilted arrangement is roughly the same with the horizontal arrangement. In the meantime, the corresponding heat transfer coefficients rises slightly with the vapor quality. The pressure drop amid tilted arrangement and horizontal one is also small for a mass flux of 200 kg/m2·s. However, for a smaller mass flux of 100 kg/m2·s, the pressure drop for tilted arrangement is slightly higher than that of horizontal one.
AB - The present study investigates the heat transfer and pressure drop characteristics of the dielectric fluid HFE-7100 within multiport microrchannel heat sink with square microchannels having a hydraulic diameter of 790 μm subject to a tilted arrangement of 45 degree. For a mass flux of 100 or 200 kg/m2·s, it is found that the heat transfer coefficients are for the tilted arrangement is roughly the same with the horizontal arrangement. In the meantime, the corresponding heat transfer coefficients rises slightly with the vapor quality. The pressure drop amid tilted arrangement and horizontal one is also small for a mass flux of 200 kg/m2·s. However, for a smaller mass flux of 100 kg/m2·s, the pressure drop for tilted arrangement is slightly higher than that of horizontal one.
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U2 - 10.1109/IMPACT.2009.5382191
DO - 10.1109/IMPACT.2009.5382191
M3 - Conference contribution
AN - SCOPUS:77950840312
SN - 9781424443413
T3 - IMPACT Conference 2009 International 3D IC Conference - Proceedings
SP - 360
EP - 363
BT - IMPACT Conference 2009 International 3D IC Conference - Proceedings
T2 - IMPACT Conference 2009 International 3D IC Conference
Y2 - 21 October 2009 through 23 October 2009
ER -