Effect of oxidizer on the galvanic behavior of Cu/Ta coupling during chemical mechanical polishing

Szu Jung Pan, Jui Chin Chen, Wen Ta Tsai

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The effect of oxidizer addition, namely, H2 O2, KIO3, and Fe (NO3) 3, on the galvanic behavior of the CuTa coupling in 0.01 M Na2 SO4 +1 wt % Al2 O3 base slurry was studied. Both open-circuit potentials of the uncoupled Cu and Ta as well as galvanic current of the CuTa were measured in static and under chemical mechanical polishing conditions to analyze the roles of these additives. The results showed that Fe (NO3) 3 was more effective than H2 O2 and KIO3 in promoting the passivation of Ta, which in turn caused the change of polarity between Cu and Ta. The effect of CuTa area ratio on the galvanic behavior of the coupling was also investigated. The results showed that in Fe (NO3) 3 -containing slurry, Ta was the anode with a CuTa area ratio of 5:1 but became the cathode with an area ratio of 1:1.

Original languageEnglish
Pages (from-to)B193-B198
JournalJournal of the Electrochemical Society
Volume153
Issue number6
DOIs
Publication statusPublished - 2006 May 15

Fingerprint

Chemical mechanical polishing
oxidizers
polishing
Passivation
Anodes
Cathodes
Networks (circuits)
passivity
polarity
anodes
cathodes

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

Cite this

Pan, Szu Jung ; Chen, Jui Chin ; Tsai, Wen Ta. / Effect of oxidizer on the galvanic behavior of Cu/Ta coupling during chemical mechanical polishing. In: Journal of the Electrochemical Society. 2006 ; Vol. 153, No. 6. pp. B193-B198.
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abstract = "The effect of oxidizer addition, namely, H2 O2, KIO3, and Fe (NO3) 3, on the galvanic behavior of the CuTa coupling in 0.01 M Na2 SO4 +1 wt {\%} Al2 O3 base slurry was studied. Both open-circuit potentials of the uncoupled Cu and Ta as well as galvanic current of the CuTa were measured in static and under chemical mechanical polishing conditions to analyze the roles of these additives. The results showed that Fe (NO3) 3 was more effective than H2 O2 and KIO3 in promoting the passivation of Ta, which in turn caused the change of polarity between Cu and Ta. The effect of CuTa area ratio on the galvanic behavior of the coupling was also investigated. The results showed that in Fe (NO3) 3 -containing slurry, Ta was the anode with a CuTa area ratio of 5:1 but became the cathode with an area ratio of 1:1.",
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Effect of oxidizer on the galvanic behavior of Cu/Ta coupling during chemical mechanical polishing. / Pan, Szu Jung; Chen, Jui Chin; Tsai, Wen Ta.

In: Journal of the Electrochemical Society, Vol. 153, No. 6, 15.05.2006, p. B193-B198.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Effect of oxidizer on the galvanic behavior of Cu/Ta coupling during chemical mechanical polishing

AU - Pan, Szu Jung

AU - Chen, Jui Chin

AU - Tsai, Wen Ta

PY - 2006/5/15

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N2 - The effect of oxidizer addition, namely, H2 O2, KIO3, and Fe (NO3) 3, on the galvanic behavior of the CuTa coupling in 0.01 M Na2 SO4 +1 wt % Al2 O3 base slurry was studied. Both open-circuit potentials of the uncoupled Cu and Ta as well as galvanic current of the CuTa were measured in static and under chemical mechanical polishing conditions to analyze the roles of these additives. The results showed that Fe (NO3) 3 was more effective than H2 O2 and KIO3 in promoting the passivation of Ta, which in turn caused the change of polarity between Cu and Ta. The effect of CuTa area ratio on the galvanic behavior of the coupling was also investigated. The results showed that in Fe (NO3) 3 -containing slurry, Ta was the anode with a CuTa area ratio of 5:1 but became the cathode with an area ratio of 1:1.

AB - The effect of oxidizer addition, namely, H2 O2, KIO3, and Fe (NO3) 3, on the galvanic behavior of the CuTa coupling in 0.01 M Na2 SO4 +1 wt % Al2 O3 base slurry was studied. Both open-circuit potentials of the uncoupled Cu and Ta as well as galvanic current of the CuTa were measured in static and under chemical mechanical polishing conditions to analyze the roles of these additives. The results showed that Fe (NO3) 3 was more effective than H2 O2 and KIO3 in promoting the passivation of Ta, which in turn caused the change of polarity between Cu and Ta. The effect of CuTa area ratio on the galvanic behavior of the coupling was also investigated. The results showed that in Fe (NO3) 3 -containing slurry, Ta was the anode with a CuTa area ratio of 5:1 but became the cathode with an area ratio of 1:1.

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