Effect of package and board characteristics on solder joint reliability of microstar BGA

Manjula Variyam, Tz Cheng Chiu, Vish Sundararaman, Darvin Edwards

Research output: Contribution to journalConference article

2 Citations (Scopus)

Abstract

Consumer demand for smaller, lower cost devices with more functionality is driving the use of ball grid array (BGA) chip scale packages (CSP) in applications ranging from wireless hand-helds to broadband gear in central office and out-door infrastructure. These different applications have widely different use-environments and reliability requirements. This gives rise to issues of consistent board-level reliability for a package under various assembly requirements and environmental conditions. It becomes necessary to understand how assembly factors such as board thickness and pad finish affect the T/C board-level solder joint reliability (BL-SJR) of the package in order to assess the reliability across different applications. A study was conducted on Texas Instrument (TI)'s MicroStar BGA™ (μ*BGA) package to understand the impact of package size, board thickness, and board-pad finish on the BL-SJR lifetime of the package. From test and simulation data, it was found that the combination of small package, thin board and organic surface protectant (OSP) pad finish resulted in long lifetimes under BL-SJR test conditions.

Original languageEnglish
Pages (from-to)583-588
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 2003 Jul 17
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: 2003 May 272003 May 30

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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