Effect of plating current density and frequency on the crystallographic texture of electrodeposited copper

Ya Wen Lin, Jui Chao Kuo, Kuan Tai Lui, Delphic Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

For interconnect materials in the microelectronic technology copper has replaced aluminum due to its lower resistivity, higher thermal conductivity and better electromigration resistance. Recently, it was found that nanotwinned copper exhibits ultra high yield strength, ductility and electrical conductivity. Therefore, in this study the effect of plating current density and frequency were investigated on the crystallographic texture of Cu electrodeposited to understand the twin character. Electron backscatter diffraction (EBSD) was used for characterizing the preferred orientation, grain size distribution, and grain boundary character distribution. Three kinds of 〈110〉, 〈111〉 and 〈112〉 textures were found to be related with the electrodeposited parameters of current density and frequency. Here we will discuss the relationship between the preferred orientation and the electrodeposited parameters.

Original languageEnglish
Title of host publicationTHERMEC 2009
EditorsTara Chandra, Tara Chandra, Tara Chandra, N. Wanderka, N. Wanderka, N. Wanderka, Walter Reimers, Walter Reimers, Walter Reimers, M. Ionescu, M. Ionescu, M. Ionescu
PublisherTrans Tech Publications Ltd
Pages2841-2845
Number of pages5
ISBN (Print)0878492941, 9780878492947
DOIs
Publication statusPublished - 2010 Jan 1
Event6th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2009 - Berlin, Germany
Duration: 2009 Aug 252009 Aug 29

Publication series

NameMaterials Science Forum
Volume638-642
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other6th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2009
CountryGermany
CityBerlin
Period09-08-2509-08-29

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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    Lin, Y. W., Kuo, J. C., Lui, K. T., & Chen, D. (2010). Effect of plating current density and frequency on the crystallographic texture of electrodeposited copper. In T. Chandra, T. Chandra, T. Chandra, N. Wanderka, N. Wanderka, N. Wanderka, W. Reimers, W. Reimers, W. Reimers, M. Ionescu, M. Ionescu, & M. Ionescu (Eds.), THERMEC 2009 (pp. 2841-2845). (Materials Science Forum; Vol. 638-642). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.638-642.2841