Effect of Pulse Plating Frequency on Electrical and Mechanical Properties of Electrodeposited Copper Films

Ya-Wen Lin, Jui-Jie Chen, Jui-Chao Kuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationIUMRS-ICA 2011暨100年中國材料科學學會年會
Place of PublicationTaipei, Taiwan
Publication statusPublished - 2011 Sep 19

Cite this

Lin, Y-W., Chen, J-J., & Kuo, J-C. (2011). Effect of Pulse Plating Frequency on Electrical and Mechanical Properties of Electrodeposited Copper Films. In IUMRS-ICA 2011暨100年中國材料科學學會年會