| Original language | English |
|---|---|
| Title of host publication | 16th APCCC |
| Place of Publication | Taiwan |
| Publication status | Published - 2012 Oct 21 |
Effect of Pulse Plating Frequency on Microstructure of Electrodeposited Copper Film
F.Y. Huang, H.P. Lin, Jui-Chao Kuo
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution