Effect of Pulse Plating Frequency on Properties of Electrodeposited Copper Films

Ya-Wen Lin, Delphic Chen, Jui-Chao Kuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationInternational Thin Films Conference TACT 2011
Place of PublicationKenting, Taiwan
Publication statusPublished - 2011 Nov 20

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