Effect of Sb addition on microstructure and shear strength of Sn-Ag solder joints

Hwa-Teng Lee, C. L. Yang, M. H. Chen, C. S. Li

Research output: Contribution to journalConference article

5 Citations (Scopus)

Abstract

The effect of Sb addition on microstructure, intermetallic compound (IMC) and mechanical properties of Sn-Ag solder joints is investigated. The compositions of selected solders are Sn2.58Ag, Sn2.82Ag1.75Sb, Sn2.87Ag4.75Sb and Sn2.7Ag8.78Sb. Experimental results show that most of the added Sb are solved in -Sn matrix, and the rest react with the Ag3Sn to form Ag3(Sb,Sn) phase, which contributes to suppress the coarsening of Ag3Sn phase. SbSn phase can be observed in β-Sn matrix as the Sb addition exceeds 4.75% and remains stable during the thermal storage test. The solder microhardness increases with increasing Sb. And the growth rate of interfacial IMC layer decreases as Sb addition increases. EPMA analysis indicates there are some Sb diffusing into the interfacial IMC layer. Shear strength of solder joints are raised by adding Sb. The shear strength by as-soldered condition are 27.8MPa (0%Sb), 29MPa (1.75%Sb), 30.4MPa (4.75%Sb) and 43.4MPa (8.78%Sb) respectively.

Original languageEnglish
Pages (from-to)501-506
Number of pages6
JournalKey Engineering Materials
Volume261-263
Issue numberI
Publication statusPublished - 2004 Jul 27
EventAdvances in Fracture and Failure Prevention: Proceedings of the Fifth International Conference on Fracture and Strength of Solids (FEOFS2003): Second International Conference on Physics and Chemistry of Fracture and Failure Prevention (2nd ICPCF) - Sendai, Japan
Duration: 2003 Oct 202003 Oct 22

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Shear strength
Soldering alloys
Intermetallics
Microstructure
Electron probe microanalysis
Coarsening
Microhardness
Mechanical properties
Chemical analysis

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Lee, Hwa-Teng ; Yang, C. L. ; Chen, M. H. ; Li, C. S. / Effect of Sb addition on microstructure and shear strength of Sn-Ag solder joints. In: Key Engineering Materials. 2004 ; Vol. 261-263, No. I. pp. 501-506.
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abstract = "The effect of Sb addition on microstructure, intermetallic compound (IMC) and mechanical properties of Sn-Ag solder joints is investigated. The compositions of selected solders are Sn2.58Ag, Sn2.82Ag1.75Sb, Sn2.87Ag4.75Sb and Sn2.7Ag8.78Sb. Experimental results show that most of the added Sb are solved in -Sn matrix, and the rest react with the Ag3Sn to form Ag3(Sb,Sn) phase, which contributes to suppress the coarsening of Ag3Sn phase. SbSn phase can be observed in β-Sn matrix as the Sb addition exceeds 4.75{\%} and remains stable during the thermal storage test. The solder microhardness increases with increasing Sb. And the growth rate of interfacial IMC layer decreases as Sb addition increases. EPMA analysis indicates there are some Sb diffusing into the interfacial IMC layer. Shear strength of solder joints are raised by adding Sb. The shear strength by as-soldered condition are 27.8MPa (0{\%}Sb), 29MPa (1.75{\%}Sb), 30.4MPa (4.75{\%}Sb) and 43.4MPa (8.78{\%}Sb) respectively.",
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Effect of Sb addition on microstructure and shear strength of Sn-Ag solder joints. / Lee, Hwa-Teng; Yang, C. L.; Chen, M. H.; Li, C. S.

In: Key Engineering Materials, Vol. 261-263, No. I, 27.07.2004, p. 501-506.

Research output: Contribution to journalConference article

TY - JOUR

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