Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate

Wei Luen Jang, Tsung Chieh Chiu, Kwang-Lung Lin

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The adhesion strength of Ti/Ni/Ag multi-layers on AlN substrates before and after thermal cycling treatment was studied. The Ti/Ni/Ag layers with thicknesses of 0.6, 1.0, and 0.2 μm, respectively, were deposited sequentially on bulk AlN substrates using direct current (DC) sputtering. Thermal cycling test (TCT) was conducted for 0, 15, 100, and 300 cycles to measure the adhesion strength of Ti/Ni/Ag on AlN. The adhesion strength of the deposited specimen increased slightly over 15 thermal cycles and increased abruptly after 100 thermal cycles. After 100 thermal cycles, Ti reacted with AlN substrate to form TiN and TiO. The formation of TiN and TiO at the Ti/AlN interface may be responsible for the increase of the adhesion strength after a large number of thermal cycles.

Original languageEnglish
Pages (from-to)5539-5543
Number of pages5
JournalThin Solid Films
Volume519
Issue number16
DOIs
Publication statusPublished - 2011 Jun 1

Fingerprint

Bond strength (materials)
Thermal cycling
adhesion
cycles
Substrates
thermal cycling tests
Sputtering
titanium nickelide
Hot Temperature
sputtering
direct current

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Metals and Alloys
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Jang, Wei Luen ; Chiu, Tsung Chieh ; Lin, Kwang-Lung. / Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate. In: Thin Solid Films. 2011 ; Vol. 519, No. 16. pp. 5539-5543.
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Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate. / Jang, Wei Luen; Chiu, Tsung Chieh; Lin, Kwang-Lung.

In: Thin Solid Films, Vol. 519, No. 16, 01.06.2011, p. 5539-5543.

Research output: Contribution to journalArticle

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