Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu

Wei Chih Huang, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Abstract

This study explored the early-stage behavior of the wetting interaction between Zn-25Sn-(0 wt.% to 0.15 wt.%)Ti and Cu substrate using the wetting balance method. High-temperature Zn-25Sn-(0 wt.% to 0.15 wt.%)Ti solders were investigated at 435°C and liquid epoxy at ambient condition to compare reactive and nonreactive wetting, respectively. The wetting curves at the early stage, before the wetting time, exhibited a plateau region reflecting the incubation period for the reactive wetting system. Such an incubation period was not observed for the nonreactive, liquid epoxy system. Cu5Zn8 and CuZn5 formed at the interface between the solder and Cu substrate in the early stage of wetting. The incubation period behavior was significantly affected by Ti addition. Ti gathered at the Cu–solder interface, thus affecting the reactive wetting behavior. The dipping temperature also affected the incubation period behavior and thus the final wetting performance. The results show that the occurrence of an incubation period was enhanced by higher reaction temperature.

Original languageEnglish
Pages (from-to)6137-6142
Number of pages6
JournalJournal of Electronic Materials
Volume45
Issue number12
DOIs
Publication statusPublished - 2016 Dec 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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