TY - JOUR
T1 - Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi
AU - Chang, Che Wei
AU - Lin, Kwang Lung
N1 - Funding Information:
Acknowledgements The authors appreciate the financial support of this study by the Ministry of Science and Technology, Republic of China (Taiwan) under MOST 104-2221-E-006-029-MY3.
Publisher Copyright:
© 2018, Springer Science+Business Media, LLC, part of Springer Nature.
PY - 2018/7/1
Y1 - 2018/7/1
N2 - This study investigated the effect of Ti content on microstructure and mechanical properties of the high temperature Pb-free solder Zn25SnxTi (x = 0–0.06). The SEM microstructure images show that the addition of Ti refined the grain size of the Zn-rich phases. It was evident that the addition of Ti tends to refine the grain size of the Zn-rich phase at the eutectic structure. The ultimate tensile strength, elongation, and toughness of the alloys were investigated with respect to Ti addition. The Zn25Sn0.02Ti exhibits the largest elongation and the best toughness among all the solders investigated. The microstructure and the fractograph of the alloys show the formation of ternary Ti–Sn–Zn compounds at the addition of 0.03%Ti and above. The variation in toughness with respect to Ti content was ascribed to the combination effect of grain refining and the formation of the intermetallic compound.
AB - This study investigated the effect of Ti content on microstructure and mechanical properties of the high temperature Pb-free solder Zn25SnxTi (x = 0–0.06). The SEM microstructure images show that the addition of Ti refined the grain size of the Zn-rich phases. It was evident that the addition of Ti tends to refine the grain size of the Zn-rich phase at the eutectic structure. The ultimate tensile strength, elongation, and toughness of the alloys were investigated with respect to Ti addition. The Zn25Sn0.02Ti exhibits the largest elongation and the best toughness among all the solders investigated. The microstructure and the fractograph of the alloys show the formation of ternary Ti–Sn–Zn compounds at the addition of 0.03%Ti and above. The variation in toughness with respect to Ti content was ascribed to the combination effect of grain refining and the formation of the intermetallic compound.
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U2 - 10.1007/s10854-018-9176-z
DO - 10.1007/s10854-018-9176-z
M3 - Article
AN - SCOPUS:85046025036
VL - 29
SP - 10962
EP - 10968
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
SN - 0957-4522
IS - 13
ER -