Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

Che Wei Chang; Kwang Lung Lin

doi:10.1007/s10854-018-9176-z

Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

Che Wei Chang, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

This study investigated the effect of Ti content on microstructure and mechanical properties of the high temperature Pb-free solder Zn25SnxTi (x = 0–0.06). The SEM microstructure images show that the addition of Ti refined the grain size of the Zn-rich phases. It was evident that the addition of Ti tends to refine the grain size of the Zn-rich phase at the eutectic structure. The ultimate tensile strength, elongation, and toughness of the alloys were investigated with respect to Ti addition. The Zn25Sn0.02Ti exhibits the largest elongation and the best toughness among all the solders investigated. The microstructure and the fractograph of the alloys show the formation of ternary Ti–Sn–Zn compounds at the addition of 0.03%Ti and above. The variation in toughness with respect to Ti content was ascribed to the combination effect of grain refining and the formation of the intermetallic compound.

Original language	English
Pages (from-to)	10962-10968
Number of pages	7
Journal	Journal of Materials Science: Materials in Electronics
Volume	29
Issue number	13
DOIs	https://doi.org/10.1007/s10854-018-9176-z
Publication status	Published - 2018 Jul 1

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

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@article{d9866d3f443448349b936ab74423c76e,

title = "Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi",

abstract = "This study investigated the effect of Ti content on microstructure and mechanical properties of the high temperature Pb-free solder Zn25SnxTi (x = 0–0.06). The SEM microstructure images show that the addition of Ti refined the grain size of the Zn-rich phases. It was evident that the addition of Ti tends to refine the grain size of the Zn-rich phase at the eutectic structure. The ultimate tensile strength, elongation, and toughness of the alloys were investigated with respect to Ti addition. The Zn25Sn0.02Ti exhibits the largest elongation and the best toughness among all the solders investigated. The microstructure and the fractograph of the alloys show the formation of ternary Ti–Sn–Zn compounds at the addition of 0.03%Ti and above. The variation in toughness with respect to Ti content was ascribed to the combination effect of grain refining and the formation of the intermetallic compound.",

author = "Chang, {Che Wei} and Lin, {Kwang Lung}",

year = "2018",

month = jul,

day = "1",

doi = "10.1007/s10854-018-9176-z",

language = "English",

volume = "29",

pages = "10962--10968",

journal = "Journal of Materials Science: Materials in Electronics",

issn = "0957-4522",

number = "13",

}

TY - JOUR

T1 - Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

AU - Chang, Che Wei

AU - Lin, Kwang Lung

PY - 2018/7/1

Y1 - 2018/7/1

N2 - This study investigated the effect of Ti content on microstructure and mechanical properties of the high temperature Pb-free solder Zn25SnxTi (x = 0–0.06). The SEM microstructure images show that the addition of Ti refined the grain size of the Zn-rich phases. It was evident that the addition of Ti tends to refine the grain size of the Zn-rich phase at the eutectic structure. The ultimate tensile strength, elongation, and toughness of the alloys were investigated with respect to Ti addition. The Zn25Sn0.02Ti exhibits the largest elongation and the best toughness among all the solders investigated. The microstructure and the fractograph of the alloys show the formation of ternary Ti–Sn–Zn compounds at the addition of 0.03%Ti and above. The variation in toughness with respect to Ti content was ascribed to the combination effect of grain refining and the formation of the intermetallic compound.

AB - This study investigated the effect of Ti content on microstructure and mechanical properties of the high temperature Pb-free solder Zn25SnxTi (x = 0–0.06). The SEM microstructure images show that the addition of Ti refined the grain size of the Zn-rich phases. It was evident that the addition of Ti tends to refine the grain size of the Zn-rich phase at the eutectic structure. The ultimate tensile strength, elongation, and toughness of the alloys were investigated with respect to Ti addition. The Zn25Sn0.02Ti exhibits the largest elongation and the best toughness among all the solders investigated. The microstructure and the fractograph of the alloys show the formation of ternary Ti–Sn–Zn compounds at the addition of 0.03%Ti and above. The variation in toughness with respect to Ti content was ascribed to the combination effect of grain refining and the formation of the intermetallic compound.

UR - http://www.scopus.com/inward/record.url?scp=85046025036&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85046025036&partnerID=8YFLogxK

U2 - 10.1007/s10854-018-9176-z

DO - 10.1007/s10854-018-9176-z

M3 - Article

AN - SCOPUS:85046025036

VL - 29

SP - 10962

EP - 10968

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

SN - 0957-4522

IS - 13

ER -

Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

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