Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

Che Wei Chang, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

This study investigated the effect of Ti content on microstructure and mechanical properties of the high temperature Pb-free solder Zn25SnxTi (x = 0–0.06). The SEM microstructure images show that the addition of Ti refined the grain size of the Zn-rich phases. It was evident that the addition of Ti tends to refine the grain size of the Zn-rich phase at the eutectic structure. The ultimate tensile strength, elongation, and toughness of the alloys were investigated with respect to Ti addition. The Zn25Sn0.02Ti exhibits the largest elongation and the best toughness among all the solders investigated. The microstructure and the fractograph of the alloys show the formation of ternary Ti–Sn–Zn compounds at the addition of 0.03%Ti and above. The variation in toughness with respect to Ti content was ascribed to the combination effect of grain refining and the formation of the intermetallic compound.

Original languageEnglish
Pages (from-to)10962-10968
Number of pages7
JournalJournal of Materials Science: Materials in Electronics
Volume29
Issue number13
DOIs
Publication statusPublished - 2018 Jul 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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