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Effective Computational Models for Addressing Asymmetric Warping of Fan-Out Reconstituted Wafer Packaging
Yu Chin Lee, Chia Yu Chen, Kuo Shen Chen, Jen Hsien Wong, Wei Hong Lai, Tang Yuan Chen, Dao Long Chen, David Tarng
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1
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(Scopus)