Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys

Chih Yao Liu; Min Hsiung Hon; Moo Chin Wang; Ying Ru Chen; Kuo Ming Chang; Wang Long Li

doi:10.1016/j.jallcom.2013.08.022

Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys

Chih Yao Liu
, Min Hsiung Hon
, Moo Chin Wang
, Ying Ru Chen
, Kuo Ming Chang
, Wang Long Li

Research output: Contribution to journal › Article › peer-review

26 Citations (Scopus)

Abstract

The effects of aging time on the mechanical properties of the Sn-9Zn-1.5Ag-xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn-9Zn- 1.5Ag-xBi solder alloys is composed of Sn-rich phase and AgZn₃. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn-9Zn-1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 2.2 MPa for Sn-9Zn-1.5Ag-3Bi solder alloy before aging.

Original language	English
Pages (from-to)	229-235
Number of pages	7
Journal	Journal of Alloys and Compounds
Volume	582
DOIs	https://doi.org/10.1016/j.jallcom.2013.08.022
Publication status	Published - 2014

All Science Journal Classification (ASJC) codes

Mechanics of Materials
Mechanical Engineering
Metals and Alloys
Materials Chemistry

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10.1016/j.jallcom.2013.08.022

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@article{c1985431a8234987a5980e0b46a53b14,

title = "Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys",

abstract = "The effects of aging time on the mechanical properties of the Sn-9Zn-1.5Ag-xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn-9Zn- 1.5Ag-xBi solder alloys is composed of Sn-rich phase and AgZn3. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn-9Zn-1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 2.2 MPa for Sn-9Zn-1.5Ag-3Bi solder alloy before aging.",

author = "Liu, \{Chih Yao\} and Hon, \{Min Hsiung\} and Wang, \{Moo Chin\} and Chen, \{Ying Ru\} and Chang, \{Kuo Ming\} and Li, \{Wang Long\}",

note = "Funding Information: This work was supported by the National Science Council of Taiwan under Contract No. NSC89-2216-E-151-011, which is gratefully acknowledged. Experimental assistance and suggestions from Mr. H.Y. Hwang and Prof. M.P. Hung are sincerely appreciated.",

year = "2014",

doi = "10.1016/j.jallcom.2013.08.022",

language = "English",

volume = "582",

pages = "229--235",

journal = "Journal of Alloys and Compounds",

issn = "0925-8388",

publisher = "Elsevier BV",

}

TY - JOUR

T1 - Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys

AU - Liu, Chih Yao

AU - Hon, Min Hsiung

AU - Wang, Moo Chin

AU - Chen, Ying Ru

AU - Chang, Kuo Ming

AU - Li, Wang Long

N1 - Funding Information: This work was supported by the National Science Council of Taiwan under Contract No. NSC89-2216-E-151-011, which is gratefully acknowledged. Experimental assistance and suggestions from Mr. H.Y. Hwang and Prof. M.P. Hung are sincerely appreciated.

PY - 2014

Y1 - 2014

N2 - The effects of aging time on the mechanical properties of the Sn-9Zn-1.5Ag-xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn-9Zn- 1.5Ag-xBi solder alloys is composed of Sn-rich phase and AgZn3. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn-9Zn-1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 2.2 MPa for Sn-9Zn-1.5Ag-3Bi solder alloy before aging.

AB - The effects of aging time on the mechanical properties of the Sn-9Zn-1.5Ag-xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn-9Zn- 1.5Ag-xBi solder alloys is composed of Sn-rich phase and AgZn3. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn-9Zn-1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 2.2 MPa for Sn-9Zn-1.5Ag-3Bi solder alloy before aging.

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DO - 10.1016/j.jallcom.2013.08.022

M3 - Article

AN - SCOPUS:84883199067

SN - 0925-8388

VL - 582

SP - 229

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JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

ER -

Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys

Abstract

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