TY - JOUR
T1 - Effects of Al, Pr additions on the wettability and interfacial reaction of Zn–25Sn solder on Cu substrate
AU - Niu, Xi
AU - Lin, Kwang Lung
N1 - Funding Information:
The authors are grateful for the financial support of this study from the Ministry of Science and Technology of the Republic of China under NSC104-2221-E-006-029-MY3. The authors are also grateful for the assistance of Dr. Kuan-Jen Chen in technical services (SIMS) by MST Instrument Center of National Cheng Kung University.
Publisher Copyright:
© 2016, Springer Science+Business Media New York.
PY - 2017/1/1
Y1 - 2017/1/1
N2 - Zn–25Sn alloy suffers from easy oxidation during soldering. This study investigated the feasibility of Al and rare earth Pr addition for enhancing the wettability of the Zn–25Sn solder. The wettability and interfacial reaction of Zn–25Sn, Zn–25Sn–0.05Al, Zn–25Sn–0.05Al–XPr (X = 0.01, 0.05, 0.08, 0.15 wt%) on Cu substrate were investigated. The additions of 0.05 wt% Al in Zn–25Sn and 0.01, 0.05 wt% Pr in Zn–25Sn–0.05Al enhanced the wettability of solders and depressed the growth of intermetallic compounds. However, the additions of 0.08, 0.15 wt% Pr in Zn–25Sn–0.05Al degraded the wettability and enhanced the growth of the intermetallic compound. Pr and Al were shown to accumulate at the surface of solders and the interfaces between solder and substrate by the Secondary Ion Mass Spectroscopy, Scanning Electron Microscope and Transmission Electron Microscopy. The phases PrZn3, Pr3Sn5 and (Cu, Al)4Zn were formed at the solder/substrate interface.
AB - Zn–25Sn alloy suffers from easy oxidation during soldering. This study investigated the feasibility of Al and rare earth Pr addition for enhancing the wettability of the Zn–25Sn solder. The wettability and interfacial reaction of Zn–25Sn, Zn–25Sn–0.05Al, Zn–25Sn–0.05Al–XPr (X = 0.01, 0.05, 0.08, 0.15 wt%) on Cu substrate were investigated. The additions of 0.05 wt% Al in Zn–25Sn and 0.01, 0.05 wt% Pr in Zn–25Sn–0.05Al enhanced the wettability of solders and depressed the growth of intermetallic compounds. However, the additions of 0.08, 0.15 wt% Pr in Zn–25Sn–0.05Al degraded the wettability and enhanced the growth of the intermetallic compound. Pr and Al were shown to accumulate at the surface of solders and the interfaces between solder and substrate by the Secondary Ion Mass Spectroscopy, Scanning Electron Microscope and Transmission Electron Microscopy. The phases PrZn3, Pr3Sn5 and (Cu, Al)4Zn were formed at the solder/substrate interface.
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U2 - 10.1007/s10854-016-5498-x
DO - 10.1007/s10854-016-5498-x
M3 - Article
AN - SCOPUS:84981287333
SN - 0957-4522
VL - 28
SP - 105
EP - 113
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
IS - 1
ER -