Effects of Average Power-Handling Capability on DC-Sputtering Aluminum Nitride Thin Film on Ceramic Substrate

Tzu Chun Tai, Hung Wei Wu, Yu Ming Lin, Sin Pei Wang, Yeong Her Wang, Shoou Jinn Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, we presented a method to investigate the effects of average power-handling capability (APHC) on dc reactive magnetron sputtering aluminum nitride (AlN) thin film coplanar waveguide (CPW) line fabricated on the ceramic substrate. We discussed the effects of material properties, microwave characteristics, and APHC on the thin-film CPW line. Using the AlN thin-film passivation on the ceramic substrate can effectively improve the thermal conductivity and enhance the APHC of a thin-film CPW line. Measured microwave losses (total of conductor loss α cf) and dielectric loss α df), dielectric constant, and APHC were extracted from S-parameters that were measured up to 10 GHz. This method can be applied in low-temperature cofired ceramic techniques (LTCC).

Original languageEnglish
Title of host publicationProceedings of the 2018 IEEE/MTT-S International Microwave Symposium, IMS 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1385-1388
Number of pages4
ISBN (Print)9781538650677
DOIs
Publication statusPublished - 2018 Aug 17
Event2018 IEEE/MTT-S International Microwave Symposium, IMS 2018 - Philadelphia, United States
Duration: 2018 Jun 102018 Jun 15

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
Volume2018-June
ISSN (Print)0149-645X

Other

Other2018 IEEE/MTT-S International Microwave Symposium, IMS 2018
CountryUnited States
CityPhiladelphia
Period18-06-1018-06-15

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All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Tai, T. C., Wu, H. W., Lin, Y. M., Wang, S. P., Wang, Y. H., & Chang, S. J. (2018). Effects of Average Power-Handling Capability on DC-Sputtering Aluminum Nitride Thin Film on Ceramic Substrate. In Proceedings of the 2018 IEEE/MTT-S International Microwave Symposium, IMS 2018 (pp. 1385-1388). [8439568] (IEEE MTT-S International Microwave Symposium Digest; Vol. 2018-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MWSYM.2018.8439568