Effects of Curing and Chemical Aging on Warpage—Characterization and Simulation

Tz-Cheng Chiu, Che Li Kung, Hong Wei Huang, Yi Shao Lai

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

In this paper, the effect of the curing process on the warpage of an encapsulated electronic package is considered by using a coupled chemical-thermomechanical modeling methodology. A cure-dependent constitutive model that consists of a cure-kinetic model, a curing- and chemical-aging-induced shrinkage model, and a degree of cure-dependent viscoelastic relaxation model was developed and implemented in a numerical finite-element model for warpage simulation. Effects of polymerization conversion and chemical aging on the warpage evolution of a bimaterial dummy package after molding and during the postmold curing (PMC) process were investigated by using the proposed modeling methodology. Shadow Moire warpage analyses were also performed to validate the numerical results. It was found from the warpage analyses that the chemical aging, while contributing little to the overall cross linking during the PMC, has a significant effect on the package warpage. The coupled chemical-thermomechanical model can be applied for performing numerical optimization for the packaging process and the assembly reliability.

Original languageEnglish
Pages (from-to)339-348
Number of pages10
JournalIEEE Transactions on Device and Materials Reliability
Volume11
Issue number2
DOIs
Publication statusPublished - 2011 Jan 1

Fingerprint

Curing
Aging of materials
Constitutive models
Molding
Packaging
Polymerization
Kinetics

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

Cite this

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Effects of Curing and Chemical Aging on Warpage—Characterization and Simulation. / Chiu, Tz-Cheng; Kung, Che Li; Huang, Hong Wei; Lai, Yi Shao.

In: IEEE Transactions on Device and Materials Reliability, Vol. 11, No. 2, 01.01.2011, p. 339-348.

Research output: Contribution to journalArticle

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