Effects of current density, pulse plating, and additives on the initial stage of gold deposition

K. Lin, R. Weil

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

The effects of current density, some pulse-plating variables, and addition agents on the initial structure of gold epitaxially electrodeposited oh silver and copper substrates were investigated. The current density was found to have little effect on the structure. Additions of arsenic, nylon, and melamine inhibited coverage of the substrate. High pulse frequencies and larger duty cycles tended to improve substrate coverage.

Original languageEnglish
Pages (from-to)690-692
Number of pages3
JournalJournal of the Electrochemical Society
Volume133
Issue number4
DOIs
Publication statusPublished - 1986 Apr

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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