Effects of current density, pulse plating, and additives on the initial stage of gold deposition

K. Lin; R. Weil

doi:10.1149/1.2108655

Effects of current density, pulse plating, and additives on the initial stage of gold deposition

K. Lin, R. Weil

Research output: Contribution to journal › Article › peer-review

14 Citations (Scopus)

Abstract

The effects of current density, some pulse-plating variables, and addition agents on the initial structure of gold epitaxially electrodeposited oh silver and copper substrates were investigated. The current density was found to have little effect on the structure. Additions of arsenic, nylon, and melamine inhibited coverage of the substrate. High pulse frequencies and larger duty cycles tended to improve substrate coverage.

Original language	English
Pages (from-to)	690-692
Number of pages	3
Journal	Journal of the Electrochemical Society
Volume	133
Issue number	4
DOIs	https://doi.org/10.1149/1.2108655
Publication status	Published - 1986 Apr

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Renewable Energy, Sustainability and the Environment
Surfaces, Coatings and Films
Electrochemistry
Materials Chemistry

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1149/1.2108655

Cite this

@article{4044824e18904dec97e686ef5e4ed113,

title = "Effects of current density, pulse plating, and additives on the initial stage of gold deposition",

abstract = "The effects of current density, some pulse-plating variables, and addition agents on the initial structure of gold epitaxially electrodeposited oh silver and copper substrates were investigated. The current density was found to have little effect on the structure. Additions of arsenic, nylon, and melamine inhibited coverage of the substrate. High pulse frequencies and larger duty cycles tended to improve substrate coverage.",

author = "K. Lin and R. Weil",

year = "1986",

month = apr,

doi = "10.1149/1.2108655",

language = "English",

volume = "133",

pages = "690--692",

journal = "Journal of the Electrochemical Society",

issn = "0013-4651",

publisher = "Electrochemical Society, Inc.",

number = "4",

}

TY - JOUR

T1 - Effects of current density, pulse plating, and additives on the initial stage of gold deposition

AU - Lin, K.

AU - Weil, R.

PY - 1986/4

Y1 - 1986/4

N2 - The effects of current density, some pulse-plating variables, and addition agents on the initial structure of gold epitaxially electrodeposited oh silver and copper substrates were investigated. The current density was found to have little effect on the structure. Additions of arsenic, nylon, and melamine inhibited coverage of the substrate. High pulse frequencies and larger duty cycles tended to improve substrate coverage.

AB - The effects of current density, some pulse-plating variables, and addition agents on the initial structure of gold epitaxially electrodeposited oh silver and copper substrates were investigated. The current density was found to have little effect on the structure. Additions of arsenic, nylon, and melamine inhibited coverage of the substrate. High pulse frequencies and larger duty cycles tended to improve substrate coverage.

UR - http://www.scopus.com/inward/record.url?scp=0022699140&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0022699140&partnerID=8YFLogxK

U2 - 10.1149/1.2108655

DO - 10.1149/1.2108655

M3 - Article

AN - SCOPUS:0022699140

SN - 0013-4651

VL - 133

SP - 690

EP - 692

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

IS - 4

ER -

Effects of current density, pulse plating, and additives on the initial stage of gold deposition

Abstract

All Science Journal Classification (ASJC) codes

UN SDGs

Access to Document

Other files and links

Fingerprint

Cite this