The effects of current density, some pulse-plating variables, and addition agents on the initial structure of gold epitaxially electrodeposited oh silver and copper substrates were investigated. The current density was found to have little effect on the structure. Additions of arsenic, nylon, and melamine inhibited coverage of the substrate. High pulse frequencies and larger duty cycles tended to improve substrate coverage.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Renewable Energy, Sustainability and the Environment
- Surfaces, Coatings and Films
- Materials Chemistry