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Effects of current density, pulse plating, and additives on the initial stage of gold deposition
K. Lin
, R. Weil
Department of Materials Science and Engineering
International Curriculum for Advanced Materials Program
Research output
:
Contribution to journal
›
Article
›
peer-review
14
Citations (Scopus)
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Engineering & Materials Science
Plating
100%
Gold
96%
Current density
86%
Substrates
63%
Arsenic
44%
Melamine
42%
Silver
32%
Copper
24%
Chemical Compounds
Current Density
65%
Additive
60%
Melamine
48%
Nylon
48%