Abstract
This study presents an electrical current testing that is based on the Sn-xAg-0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (β-Sn+Cu6Sn 5+Ag3Sn) and the base phases (β-Sn). The eutectic phases in the Sn-3Ag-0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu6Sn5 and Ag3Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn-Ag-Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.
| Original language | English |
|---|---|
| Pages (from-to) | 1155-1159 |
| Number of pages | 5 |
| Journal | Materials Transactions |
| Volume | 54 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 2013 Jul 26 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
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Effects of electrical current on microstructure and interface properties of Sn-Ag-Cu/Ag photovoltaic ribbons. / Chen, Kuan Jen; Hung, Fei Yi; Lui, Truan Sheng; Chen, Li Hui; Qiu, Dai Wen; Chou, Ta Lung.
In: Materials Transactions, Vol. 54, No. 7, 26.07.2013, p. 1155-1159.Research output: Contribution to journal › Article
TY - JOUR
T1 - Effects of electrical current on microstructure and interface properties of Sn-Ag-Cu/Ag photovoltaic ribbons
AU - Chen, Kuan Jen
AU - Hung, Fei Yi
AU - Lui, Truan Sheng
AU - Chen, Li Hui
AU - Qiu, Dai Wen
AU - Chou, Ta Lung
PY - 2013/7/26
Y1 - 2013/7/26
N2 - This study presents an electrical current testing that is based on the Sn-xAg-0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (β-Sn+Cu6Sn 5+Ag3Sn) and the base phases (β-Sn). The eutectic phases in the Sn-3Ag-0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu6Sn5 and Ag3Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn-Ag-Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.
AB - This study presents an electrical current testing that is based on the Sn-xAg-0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (β-Sn+Cu6Sn 5+Ag3Sn) and the base phases (β-Sn). The eutectic phases in the Sn-3Ag-0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu6Sn5 and Ag3Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn-Ag-Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.
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U2 - 10.2320/matertrans.M2013110
DO - 10.2320/matertrans.M2013110
M3 - Article
AN - SCOPUS:84880423757
VL - 54
SP - 1155
EP - 1159
JO - Materials Transactions
JF - Materials Transactions
SN - 0916-1821
IS - 7
ER -