Effects of electrical current on microstructure and interface properties of Sn-Ag-Cu/Ag photovoltaic ribbons

Kuan Jen Chen; Fei Yi Hung; Truan Sheng Lui; Li Hui Chen; Dai Wen Qiu; Ta Lung Chou

doi:10.2320/matertrans.M2013110

Effects of electrical current on microstructure and interface properties of Sn-Ag-Cu/Ag photovoltaic ribbons

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Dai Wen Qiu, Ta Lung Chou

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

This study presents an electrical current testing that is based on the Sn-xAg-0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (β-Sn+Cu₆Sn ₅+Ag₃Sn) and the base phases (β-Sn). The eutectic phases in the Sn-3Ag-0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu₆Sn₅ and Ag₃Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn-Ag-Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.

Original language	English
Pages (from-to)	1155-1159
Number of pages	5
Journal	Materials Transactions
Volume	54
Issue number	7
DOIs	https://doi.org/10.2320/matertrans.M2013110
Publication status	Published - 2013

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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title = "Effects of electrical current on microstructure and interface properties of Sn-Ag-Cu/Ag photovoltaic ribbons",

abstract = "This study presents an electrical current testing that is based on the Sn-xAg-0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (β-Sn+Cu6Sn 5+Ag3Sn) and the base phases (β-Sn). The eutectic phases in the Sn-3Ag-0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu6Sn5 and Ag3Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn-Ag-Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.",

author = "Chen, {Kuan Jen} and Hung, {Fei Yi} and Lui, {Truan Sheng} and Chen, {Li Hui} and Qiu, {Dai Wen} and Chou, {Ta Lung}",

year = "2013",

doi = "10.2320/matertrans.M2013110",

language = "English",

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pages = "1155--1159",

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T1 - Effects of electrical current on microstructure and interface properties of Sn-Ag-Cu/Ag photovoltaic ribbons

AU - Chen, Kuan Jen

AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Chen, Li Hui

AU - Qiu, Dai Wen

AU - Chou, Ta Lung

PY - 2013

Y1 - 2013

N2 - This study presents an electrical current testing that is based on the Sn-xAg-0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (β-Sn+Cu6Sn 5+Ag3Sn) and the base phases (β-Sn). The eutectic phases in the Sn-3Ag-0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu6Sn5 and Ag3Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn-Ag-Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.

AB - This study presents an electrical current testing that is based on the Sn-xAg-0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (β-Sn+Cu6Sn 5+Ag3Sn) and the base phases (β-Sn). The eutectic phases in the Sn-3Ag-0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu6Sn5 and Ag3Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn-Ag-Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.

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Effects of electrical current on microstructure and interface properties of Sn-Ag-Cu/Ag photovoltaic ribbons

Abstract

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