Effects of electrical current on microstructure and interface properties of Sn-Ag-Cu/Ag photovoltaic ribbons

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Dai Wen Qiu, Ta Lung Chou

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

This study presents an electrical current testing that is based on the Sn-xAg-0.5Cu (x = 1, 3 mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (β-Sn+Cu6Sn 5+Ag3Sn) and the base phases (β-Sn). The eutectic phases in the Sn-3Ag-0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu6Sn5 and Ag3Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn-Ag-Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.

Original languageEnglish
Pages (from-to)1155-1159
Number of pages5
JournalMaterials Transactions
Volume54
Issue number7
DOIs
Publication statusPublished - 2013 Jul 26

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ribbons
Intermetallics
intermetallics
microstructure
Microstructure
solders
eutectics
Soldering alloys
Eutectics
soldering
Thermal diffusion
Soldering
thermal diffusion
Testing

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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abstract = "This study presents an electrical current testing that is based on the Sn-xAg-0.5Cu (x = 1, 3 mass{\%}) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (β-Sn+Cu6Sn 5+Ag3Sn) and the base phases (β-Sn). The eutectic phases in the Sn-3Ag-0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu6Sn5 and Ag3Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn-Ag-Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40 h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon.",
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Effects of electrical current on microstructure and interface properties of Sn-Ag-Cu/Ag photovoltaic ribbons. / Chen, Kuan Jen; Hung, Fei Yi; Lui, Truan Sheng; Chen, Li Hui; Qiu, Dai Wen; Chou, Ta Lung.

In: Materials Transactions, Vol. 54, No. 7, 26.07.2013, p. 1155-1159.

Research output: Contribution to journalArticle

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AU - Chen, Kuan Jen

AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Chen, Li Hui

AU - Qiu, Dai Wen

AU - Chou, Ta Lung

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