Abstract
The requirement for smaller devices but with much greater performance leads to a boost in current density and damage caused by electromigration. Recently, some researches show that the grain orientation changes during current stressing. In this study, the solder of SnAg2.6 with 2um-thick UBM layer of Ni and 20um-thick copper pad is used. Electron Backscattered Diffraction (EBSD) is applied to investigate the grain orientation in the entire solder joint during electromigration. Semi-In-situ observations are to determine the rate of change on grain orientation of tin. We can analysis these data at the same time to understand the relationship between the rotation rate of tin grain orientations and the current density applied on it. The analysis for current density in solders is accomplished by finite element simulation result. So far, based on our preliminary result, there are obvious grain rotations when they are subjected to current stressing and detailed results will be presented in the conference.
| Original language | English |
|---|---|
| Title of host publication | IMPACT Conference 2009 International 3D IC Conference - Proceedings |
| Pages | 166-168 |
| Number of pages | 3 |
| DOIs | |
| Publication status | Published - 2009 Dec 1 |
| Event | IMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan Duration: 2009 Oct 21 → 2009 Oct 23 |
Publication series
| Name | IMPACT Conference 2009 International 3D IC Conference - Proceedings |
|---|
Other
| Other | IMPACT Conference 2009 International 3D IC Conference |
|---|---|
| Country | Taiwan |
| City | Taipei |
| Period | 09-10-21 → 09-10-23 |
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All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
Cite this
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Effects of electromigration on grain rotation behavior of SnAg solders. / Lin, Han Wen; Chen, Chih; Kuo, Jui-Chao; Chen, C. C.
IMPACT Conference 2009 International 3D IC Conference - Proceedings. 2009. p. 166-168 5382151 (IMPACT Conference 2009 International 3D IC Conference - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Effects of electromigration on grain rotation behavior of SnAg solders
AU - Lin, Han Wen
AU - Chen, Chih
AU - Kuo, Jui-Chao
AU - Chen, C. C.
PY - 2009/12/1
Y1 - 2009/12/1
N2 - The requirement for smaller devices but with much greater performance leads to a boost in current density and damage caused by electromigration. Recently, some researches show that the grain orientation changes during current stressing. In this study, the solder of SnAg2.6 with 2um-thick UBM layer of Ni and 20um-thick copper pad is used. Electron Backscattered Diffraction (EBSD) is applied to investigate the grain orientation in the entire solder joint during electromigration. Semi-In-situ observations are to determine the rate of change on grain orientation of tin. We can analysis these data at the same time to understand the relationship between the rotation rate of tin grain orientations and the current density applied on it. The analysis for current density in solders is accomplished by finite element simulation result. So far, based on our preliminary result, there are obvious grain rotations when they are subjected to current stressing and detailed results will be presented in the conference.
AB - The requirement for smaller devices but with much greater performance leads to a boost in current density and damage caused by electromigration. Recently, some researches show that the grain orientation changes during current stressing. In this study, the solder of SnAg2.6 with 2um-thick UBM layer of Ni and 20um-thick copper pad is used. Electron Backscattered Diffraction (EBSD) is applied to investigate the grain orientation in the entire solder joint during electromigration. Semi-In-situ observations are to determine the rate of change on grain orientation of tin. We can analysis these data at the same time to understand the relationship between the rotation rate of tin grain orientations and the current density applied on it. The analysis for current density in solders is accomplished by finite element simulation result. So far, based on our preliminary result, there are obvious grain rotations when they are subjected to current stressing and detailed results will be presented in the conference.
UR - http://www.scopus.com/inward/record.url?scp=77950800753&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77950800753&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2009.5382151
DO - 10.1109/IMPACT.2009.5382151
M3 - Conference contribution
SN - 9781424443413
T3 - IMPACT Conference 2009 International 3D IC Conference - Proceedings
SP - 166
EP - 168
BT - IMPACT Conference 2009 International 3D IC Conference - Proceedings
ER -