Effects of electromigration on grain rotation behavior of SnAg solders

Han Wen Lin, Chih Chen, J. C. Kuo, C. C. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The requirement for smaller devices but with much greater performance leads to a boost in current density and damage caused by electromigration. Recently, some researches show that the grain orientation changes during current stressing. In this study, the solder of SnAg2.6 with 2um-thick UBM layer of Ni and 20um-thick copper pad is used. Electron Backscattered Diffraction (EBSD) is applied to investigate the grain orientation in the entire solder joint during electromigration. Semi-In-situ observations are to determine the rate of change on grain orientation of tin. We can analysis these data at the same time to understand the relationship between the rotation rate of tin grain orientations and the current density applied on it. The analysis for current density in solders is accomplished by finite element simulation result. So far, based on our preliminary result, there are obvious grain rotations when they are subjected to current stressing and detailed results will be presented in the conference.

Original languageEnglish
Title of host publicationIMPACT Conference 2009 International 3D IC Conference - Proceedings
Pages166-168
Number of pages3
DOIs
Publication statusPublished - 2009 Dec 1
EventIMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
Duration: 2009 Oct 212009 Oct 23

Publication series

NameIMPACT Conference 2009 International 3D IC Conference - Proceedings

Other

OtherIMPACT Conference 2009 International 3D IC Conference
CountryTaiwan
CityTaipei
Period09-10-2109-10-23

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Lin, H. W., Chen, C., Kuo, J. C., & Chen, C. C. (2009). Effects of electromigration on grain rotation behavior of SnAg solders. In IMPACT Conference 2009 International 3D IC Conference - Proceedings (pp. 166-168). [5382151] (IMPACT Conference 2009 International 3D IC Conference - Proceedings). https://doi.org/10.1109/IMPACT.2009.5382151