The power consumption (PC), window margin (WM), thermal stability (TS), and reliability [i.e., endurance (EN) and retention-time (RT)] of aluminum nitride (AlN) resistive random access memory (RRAM) devices with different film orientations [i.e., amorphous, (100)-and (002)-oriented] are investigated. It is shown that the charge carrier transport mechanism of the three devices is dominated by Ohmic behavior under low electric fields and the trap-controlled space charge limited current (TC-SCLC) model under high electric fields. Among the three devices, the (002)-oriented AlN sample provides the best overall PC, WM, TS, EN, and RT performance due to its c-axis orientation, which is favorable for the formation and rupture of the vertically arranged conductive filaments (CFS) in the AlN film.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering