Effects of Ga addition on the wetting properties and tensile properties of Sn-Zn-Ag solder alloys

Kang I. Chen, Chin Hsiang Cheng, Sean Wu, Yeu Long Jiang, Tsung Chie Cheng

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The effects of Ga addition on the wetting properties and tensile properties of Sn-8.55Zn-0.5Ag-xGa lead-free solder alloys are investigated. The x content of the solders investigated is 0~3 wt%. The results indicate that Ga exhibits a prominent influence on the wetting behavior as well as the mechanical properties of the solders. The wetting properties are improved remarkably with the increase of the Ga content in the Sn-8.55Zn-0.5Ag lead-free solder. The tensile test shows that 1~2% Ga alloys have significant improvement in UTS, when compared with that of the binary Sn-Zn and Sn-Zn-0.5Ag alloys. As for Sn-Zn-0.5Ag, the addition of Ga elements has provided a good wetting force, wetting time and tensile strength.

Original languageEnglish
Pages (from-to)621-627
Number of pages7
JournalIndian Journal of Engineering and Materials Sciences
Volume21
Issue number6
Publication statusPublished - 2014 Dec 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

Fingerprint Dive into the research topics of 'Effects of Ga addition on the wetting properties and tensile properties of Sn-Zn-Ag solder alloys'. Together they form a unique fingerprint.

Cite this