Effects of Ga addition on the wetting properties and tensile properties of Sn-Zn-Ag solder alloys

Kang I. Chen, Chin Hsiang Cheng, Sean Wu, Yeu Long Jiang, Tsung Chie Cheng

Research output: Contribution to journalArticle

Abstract

The effects of Ga addition on the wetting properties and tensile properties of Sn-8.55Zn-0.5Ag-xGa lead-free solder alloys are investigated. The x content of the solders investigated is 0~3 wt%. The results indicate that Ga exhibits a prominent influence on the wetting behavior as well as the mechanical properties of the solders. The wetting properties are improved remarkably with the increase of the Ga content in the Sn-8.55Zn-0.5Ag lead-free solder. The tensile test shows that 1~2% Ga alloys have significant improvement in UTS, when compared with that of the binary Sn-Zn and Sn-Zn-0.5Ag alloys. As for Sn-Zn-0.5Ag, the addition of Ga elements has provided a good wetting force, wetting time and tensile strength.

Original languageEnglish
Pages (from-to)621-627
Number of pages7
JournalIndian Journal of Engineering and Materials Sciences
Volume21
Issue number6
Publication statusPublished - 2014 Dec 1

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Tensile properties
Soldering alloys
Wetting
Tensile strength
Mechanical properties
Lead-free solders

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

Cite this

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title = "Effects of Ga addition on the wetting properties and tensile properties of Sn-Zn-Ag solder alloys",
abstract = "The effects of Ga addition on the wetting properties and tensile properties of Sn-8.55Zn-0.5Ag-xGa lead-free solder alloys are investigated. The x content of the solders investigated is 0~3 wt{\%}. The results indicate that Ga exhibits a prominent influence on the wetting behavior as well as the mechanical properties of the solders. The wetting properties are improved remarkably with the increase of the Ga content in the Sn-8.55Zn-0.5Ag lead-free solder. The tensile test shows that 1~2{\%} Ga alloys have significant improvement in UTS, when compared with that of the binary Sn-Zn and Sn-Zn-0.5Ag alloys. As for Sn-Zn-0.5Ag, the addition of Ga elements has provided a good wetting force, wetting time and tensile strength.",
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Effects of Ga addition on the wetting properties and tensile properties of Sn-Zn-Ag solder alloys. / Chen, Kang I.; Cheng, Chin Hsiang; Wu, Sean; Jiang, Yeu Long; Cheng, Tsung Chie.

In: Indian Journal of Engineering and Materials Sciences, Vol. 21, No. 6, 01.12.2014, p. 621-627.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Effects of Ga addition on the wetting properties and tensile properties of Sn-Zn-Ag solder alloys

AU - Chen, Kang I.

AU - Cheng, Chin Hsiang

AU - Wu, Sean

AU - Jiang, Yeu Long

AU - Cheng, Tsung Chie

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AB - The effects of Ga addition on the wetting properties and tensile properties of Sn-8.55Zn-0.5Ag-xGa lead-free solder alloys are investigated. The x content of the solders investigated is 0~3 wt%. The results indicate that Ga exhibits a prominent influence on the wetting behavior as well as the mechanical properties of the solders. The wetting properties are improved remarkably with the increase of the Ga content in the Sn-8.55Zn-0.5Ag lead-free solder. The tensile test shows that 1~2% Ga alloys have significant improvement in UTS, when compared with that of the binary Sn-Zn and Sn-Zn-0.5Ag alloys. As for Sn-Zn-0.5Ag, the addition of Ga elements has provided a good wetting force, wetting time and tensile strength.

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