Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys

Kang I. Chen; Kwang Lung Lin

doi:10.1109/EMAP.2002.1188812

Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys

Kang I. Chen, Kwang Lung Lin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

11 Citations (Scopus)

Abstract

The microstructures and mechanical properties of Sn-8.55Zn-0.5 Ag-0.45Al -yGa (wt %) and wetting behavior of Sn-8.55Zn-0.5Ag-yGa (wt %) lead-free solders were investigated. The Ga content, y, of the solders investigated were 0.5 wt % ∼3.0 wt %. The results indicate that Ga plays an important role not only in the structure and wetting behavior, but also in the mechanical properties. The mechanical properties and DSC behavior were compared with that of 63Sn-37Pb and Sn-9Zn solders. Ga lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solders exhibit greater strength and better ductility than the 63Sn-37Pb.

Original language	English
Title of host publication	Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	49-54
Number of pages	6
ISBN (Electronic)	078037682X, 9780780376823
DOIs	https://doi.org/10.1109/EMAP.2002.1188812
Publication status	Published - 2002 Jan 1
Event	4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan Duration: 2002 Dec 4 → 2002 Dec 6

Publication series

Name	Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other	4th International Symposium on Electronic Materials and Packaging, EMAP 2002
Country/Territory	Taiwan
City	Kaohsiung
Period	02-12-04 → 02-12-06

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Materials Science(all)

Access to Document

10.1109/EMAP.2002.1188812

Cite this

Chen, K. I., & Lin, K. L. (2002). Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (pp. 49-54). [1188812] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188812

Chen, Kang I. ; Lin, Kwang Lung. / Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys. Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 49-54 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

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title = "Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys",

abstract = "The microstructures and mechanical properties of Sn-8.55Zn-0.5 Ag-0.45Al -yGa (wt %) and wetting behavior of Sn-8.55Zn-0.5Ag-yGa (wt %) lead-free solders were investigated. The Ga content, y, of the solders investigated were 0.5 wt % ∼3.0 wt %. The results indicate that Ga plays an important role not only in the structure and wetting behavior, but also in the mechanical properties. The mechanical properties and DSC behavior were compared with that of 63Sn-37Pb and Sn-9Zn solders. Ga lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solders exhibit greater strength and better ductility than the 63Sn-37Pb.",

author = "Chen, {Kang I.} and Lin, {Kwang Lung}",

year = "2002",

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publisher = "Institute of Electrical and Electronics Engineers Inc.",

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booktitle = "Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002",

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Chen, KI & Lin, KL 2002, Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys. in Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002., 1188812, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Institute of Electrical and Electronics Engineers Inc., pp. 49-54, 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Kaohsiung, Taiwan, 02-12-04. https://doi.org/10.1109/EMAP.2002.1188812

Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys. / Chen, Kang I.; Lin, Kwang Lung.

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 49-54 1188812 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys

AU - Chen, Kang I.

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Y1 - 2002/1/1

N2 - The microstructures and mechanical properties of Sn-8.55Zn-0.5 Ag-0.45Al -yGa (wt %) and wetting behavior of Sn-8.55Zn-0.5Ag-yGa (wt %) lead-free solders were investigated. The Ga content, y, of the solders investigated were 0.5 wt % ∼3.0 wt %. The results indicate that Ga plays an important role not only in the structure and wetting behavior, but also in the mechanical properties. The mechanical properties and DSC behavior were compared with that of 63Sn-37Pb and Sn-9Zn solders. Ga lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solders exhibit greater strength and better ductility than the 63Sn-37Pb.

AB - The microstructures and mechanical properties of Sn-8.55Zn-0.5 Ag-0.45Al -yGa (wt %) and wetting behavior of Sn-8.55Zn-0.5Ag-yGa (wt %) lead-free solders were investigated. The Ga content, y, of the solders investigated were 0.5 wt % ∼3.0 wt %. The results indicate that Ga plays an important role not only in the structure and wetting behavior, but also in the mechanical properties. The mechanical properties and DSC behavior were compared with that of 63Sn-37Pb and Sn-9Zn solders. Ga lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solders exhibit greater strength and better ductility than the 63Sn-37Pb.

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Y2 - 4 December 2002 through 6 December 2002

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Chen KI, Lin KL. Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 49-54. 1188812. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). https://doi.org/10.1109/EMAP.2002.1188812

Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys

Abstract

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