Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys

Kang I. Chen, Kwang Lung Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

The microstructures and mechanical properties of Sn-8.55Zn-0.5 Ag-0.45Al -yGa (wt %) and wetting behavior of Sn-8.55Zn-0.5Ag-yGa (wt %) lead-free solders were investigated. The Ga content, y, of the solders investigated were 0.5 wt % ∼3.0 wt %. The results indicate that Ga plays an important role not only in the structure and wetting behavior, but also in the mechanical properties. The mechanical properties and DSC behavior were compared with that of 63Sn-37Pb and Sn-9Zn solders. Ga lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solders exhibit greater strength and better ductility than the 63Sn-37Pb.

Original languageEnglish
Title of host publicationProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages49-54
Number of pages6
ISBN (Electronic)078037682X, 9780780376823
DOIs
Publication statusPublished - 2002 Jan 1
Event4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan
Duration: 2002 Dec 42002 Dec 6

Publication series

NameProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
CountryTaiwan
CityKaohsiung
Period02-12-0402-12-06

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

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