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Effects of hydrogen peroxide and alumina on surface characteristics of copper chemical-mechanical polishing in citric acid slurries
Jui Chin Chen, Wen Ta Tsai
Department of Materials Science and Engineering
International Curriculum for Advanced Materials Program
Research output
:
Contribution to journal
›
Article
›
peer-review
27
Citations (Scopus)
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Dive into the research topics of 'Effects of hydrogen peroxide and alumina on surface characteristics of copper chemical-mechanical polishing in citric acid slurries'. Together they form a unique fingerprint.
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Engineering & Materials Science
Citric acid
100%
Chemical mechanical polishing
87%
Hydrogen peroxide
86%
Slurries
82%
Surface morphology
75%
Alumina
66%
Copper
54%
Chelation
51%
Atomic force microscopy
42%
X ray photoelectron spectroscopy
40%
Passivation
40%
Dissolution
35%
Abrasives
34%
Oxides
28%
Metals
21%
Networks (circuits)
18%
Physics & Astronomy
citric acid
93%
slurries
88%
hydrogen peroxide
81%
polishing
70%
aluminum oxides
54%
copper
47%
abrasives
19%
passivity
15%
dissolving
15%
photoelectron spectroscopy
13%
atomic force microscopy
12%
oxides
10%
metals
8%
x rays
7%
Chemical Compounds
Polishing
77%
Citric Acid
64%
Hydrogen Peroxide
51%
Abrasive
27%
Open Circuit Potential
25%
Chelating Agent
21%
Surface
21%
Atomic Force Microscopy
17%
X-Ray Photoelectron Spectroscopy
15%
Oxide
12%
Metal
10%