Effects of internal heat generation on optimal shape design for packaging containing heating objects using inverse heat transfer method

Chin-Hsiang Cheng, Hung Hsiang Lin, Win Aung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The present study is concerned with the determination of the optimal shape for packages containing heating substrates or objects. An design optimization tool has been developed based on an inverse heat transfer (IHT) approach, which incorporates a direct problem solver, a grid generator, a sensitivity analyzer, and the conjugate gradient method. Shape design that features an isothermal outer surface or meets other specified thermal requirements is predicted by the approach. In this study, the effects of internal heat generation on optimal shapes of the packagings have been evaluated. Several practical cases with various imbedded heating objects and thermal boundary conditions are studied to demonstrate the performance of the approach.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging; Thermal Manegement Reliability
Pages1057-1063
Number of pages7
Publication statusPublished - 2001 Dec 1
EventPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition - Kauai, Hi, United States
Duration: 2001 Jul 82001 Jul 13

Publication series

NameAdvances in Electronic Packaging
Volume2

Other

OtherPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition
CountryUnited States
CityKauai, Hi
Period01-07-0801-07-13

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Electrical and Electronic Engineering

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  • Cite this

    Cheng, C-H., Lin, H. H., & Aung, W. (2001). Effects of internal heat generation on optimal shape design for packaging containing heating objects using inverse heat transfer method. In Advances in Electronic Packaging; Thermal Manegement Reliability (pp. 1057-1063). (Advances in Electronic Packaging; Vol. 2).