Abstract
Thin Ta2O5 films were prepared by low-pressure chemical vapor deposition (LPCVD) and subsequently annealed in O2 ambient at various temperatures. It was found that the leakage current of the Ta2O5/SiOx capacitor was controlled by the Ta2O5 layer when the annealing temperature was lower than 700°C. On the other hand, the leakage current was controlled by the interracial oxide layer when the annealing temperature was higher than 700°C. It was also found that we could achieve an equivalent thin oxide thickness and a small leakage current at the same time from the Ta2O5/SiOx capacitor with a suitable thermal annealing treatment.
| Original language | English |
|---|---|
| Pages (from-to) | 690-693 |
| Number of pages | 4 |
| Journal | Japanese Journal of Applied Physics |
| Volume | 41 |
| Issue number | 2 A |
| DOIs | |
| Publication status | Published - 2002 Feb |
All Science Journal Classification (ASJC) codes
- General Engineering
- General Physics and Astronomy
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