Effects of Mn2+ on the electrical resistance of electrolessly plated Ni-P thin-film and its application as embedded resistor

Guoyun Zhou, Chia Yun Chen, Ziyin Lin, Liyi Li, Zhihua Tao, Wei He, Ching Ping Wong

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

The effects of manganese sulfate monohydrate (denoted as MSM) on the properties of electroless Ni-P thin-film were investigated. The properties of Ni-P thin-film were examined by means of atomic force microscopy (AFM), cyclic voltammetry, scanning electron microscopy (SEM), X-ray diffraction, energy-dispersive X-ray spectrometer and X-ray photoelectron spectroscopy. AFM and SEM results showed that MSM had significant influences on the morphology, including the formation of smaller nodules, nano-size particles boundaries on both surface and inside of nodules. Due to the specific topologies, the resistance of Ni-P thin-film deposited with MSM was increased. Based on the characterization results, we summarized that the Mn2+ or Mn 2+-compound were primarily confirmed to act as the stabilizer in Ni-P electroless process. Moreover, the verification test for Ni-P thin-film in application as embedded resistor was carried out through electrical, thermal stability examination by means of current-voltage (I-V), temperature coefficient of resistance and thermal shock tests, respectively. Experiment results demonstrated the Ni-P thin-film deposited with MSM is qualified for embedded resistors.

Original languageEnglish
Pages (from-to)1341-1347
Number of pages7
JournalJournal of Materials Science: Materials in Electronics
Volume25
Issue number3
DOIs
Publication statusPublished - 2014 Mar

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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