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Effects of post-CMP cleaning on time dependent dielectric breakdown and electro-migration in porous low-kCu interconnects
Chia Lin Hsu, Dung Ching Perng, Wen Chin Lin, Kuan Ting Lu, Teng Chun Tsai, Climbing Huang, J. Y. Wu
Research output: Contribution to journal › Article › peer-review
9
Citations
(Scopus)