Abstract
In IC packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. However, there was no report showing how to measure the mold adhesion force. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. This paper also described the study of the IC encapsulation mold adhesion force using Taguchi's parameter design method. By using Taguchi's method, one can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.
| Original language | English |
|---|---|
| Title of host publication | 2002 Proceedings - 8th International Advanced Packaging Materials Symposium |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 166-171 |
| Number of pages | 6 |
| ISBN (Electronic) | 0780374347, 9780780374348 |
| DOIs | |
| Publication status | Published - 2002 Jan 1 |
| Event | 8th International Advanced Packaging Materials Symposium - Stone Mountain, United States Duration: 2002 Mar 3 → 2002 Mar 6 |
Publication series
| Name | 2002 Proceedings - 8th International Advanced Packaging Materials Symposium |
|---|
Other
| Other | 8th International Advanced Packaging Materials Symposium |
|---|---|
| Country | United States |
| City | Stone Mountain |
| Period | 02-03-03 → 02-03-06 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
Cite this
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Effects of process parameters on the mold adhesion force in IC encapsulation process. / Hwang, Sheng-Jye; Lee, Huei-Huang; Chuang, Chun Hua; Huang, Duan Yuan.
2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., 2002. p. 166-171 990381 (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Effects of process parameters on the mold adhesion force in IC encapsulation process
AU - Hwang, Sheng-Jye
AU - Lee, Huei-Huang
AU - Chuang, Chun Hua
AU - Huang, Duan Yuan
PY - 2002/1/1
Y1 - 2002/1/1
N2 - In IC packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. However, there was no report showing how to measure the mold adhesion force. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. This paper also described the study of the IC encapsulation mold adhesion force using Taguchi's parameter design method. By using Taguchi's method, one can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.
AB - In IC packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. However, there was no report showing how to measure the mold adhesion force. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. This paper also described the study of the IC encapsulation mold adhesion force using Taguchi's parameter design method. By using Taguchi's method, one can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.
UR - http://www.scopus.com/inward/record.url?scp=84949948301&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84949948301&partnerID=8YFLogxK
U2 - 10.1109/ISAPM.2002.990381
DO - 10.1109/ISAPM.2002.990381
M3 - Conference contribution
AN - SCOPUS:84949948301
T3 - 2002 Proceedings - 8th International Advanced Packaging Materials Symposium
SP - 166
EP - 171
BT - 2002 Proceedings - 8th International Advanced Packaging Materials Symposium
PB - Institute of Electrical and Electronics Engineers Inc.
ER -