Effects of process parameters on the mold adhesion force in IC encapsulation process

Sheng-Jye Hwang, Huei-Huang Lee, Chun Hua Chuang, Duan Yuan Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In IC packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. However, there was no report showing how to measure the mold adhesion force. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. This paper also described the study of the IC encapsulation mold adhesion force using Taguchi's parameter design method. By using Taguchi's method, one can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.

Original languageEnglish
Title of host publication2002 Proceedings - 8th International Advanced Packaging Materials Symposium
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages166-171
Number of pages6
ISBN (Electronic)0780374347, 9780780374348
DOIs
Publication statusPublished - 2002 Jan 1
Event8th International Advanced Packaging Materials Symposium - Stone Mountain, United States
Duration: 2002 Mar 32002 Mar 6

Publication series

Name2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Other

Other8th International Advanced Packaging Materials Symposium
CountryUnited States
CityStone Mountain
Period02-03-0302-03-06

Fingerprint

Encapsulation
Adhesion
Sheet molding compounds
Taguchi methods
Surface treatment
Packaging
Fabrication

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials

Cite this

Hwang, S-J., Lee, H-H., Chuang, C. H., & Huang, D. Y. (2002). Effects of process parameters on the mold adhesion force in IC encapsulation process. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium (pp. 166-171). [990381] (2002 Proceedings - 8th International Advanced Packaging Materials Symposium). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISAPM.2002.990381
Hwang, Sheng-Jye ; Lee, Huei-Huang ; Chuang, Chun Hua ; Huang, Duan Yuan. / Effects of process parameters on the mold adhesion force in IC encapsulation process. 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 166-171 (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).
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Hwang, S-J, Lee, H-H, Chuang, CH & Huang, DY 2002, Effects of process parameters on the mold adhesion force in IC encapsulation process. in 2002 Proceedings - 8th International Advanced Packaging Materials Symposium., 990381, 2002 Proceedings - 8th International Advanced Packaging Materials Symposium, Institute of Electrical and Electronics Engineers Inc., pp. 166-171, 8th International Advanced Packaging Materials Symposium, Stone Mountain, United States, 02-03-03. https://doi.org/10.1109/ISAPM.2002.990381

Effects of process parameters on the mold adhesion force in IC encapsulation process. / Hwang, Sheng-Jye; Lee, Huei-Huang; Chuang, Chun Hua; Huang, Duan Yuan.

2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., 2002. p. 166-171 990381 (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Hwang S-J, Lee H-H, Chuang CH, Huang DY. Effects of process parameters on the mold adhesion force in IC encapsulation process. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc. 2002. p. 166-171. 990381. (2002 Proceedings - 8th International Advanced Packaging Materials Symposium). https://doi.org/10.1109/ISAPM.2002.990381