TY - GEN
T1 - Effects of process parameters on the mold adhesion force in IC encapsulation process
AU - Hwang, Sheng Jye
AU - Lee, Huei Huang
AU - Chuang, Chun Hua
AU - Huang, Duan Yuan
N1 - Publisher Copyright:
© 2002 IEEE.
PY - 2002
Y1 - 2002
N2 - In IC packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. However, there was no report showing how to measure the mold adhesion force. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. This paper also described the study of the IC encapsulation mold adhesion force using Taguchi's parameter design method. By using Taguchi's method, one can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.
AB - In IC packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. However, there was no report showing how to measure the mold adhesion force. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. This paper also described the study of the IC encapsulation mold adhesion force using Taguchi's parameter design method. By using Taguchi's method, one can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.
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U2 - 10.1109/ISAPM.2002.990381
DO - 10.1109/ISAPM.2002.990381
M3 - Conference contribution
AN - SCOPUS:84949948301
T3 - 2002 Proceedings - 8th International Advanced Packaging Materials Symposium
SP - 166
EP - 171
BT - 2002 Proceedings - 8th International Advanced Packaging Materials Symposium
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 8th International Advanced Packaging Materials Symposium
Y2 - 3 March 2002 through 6 March 2002
ER -