Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy

Kang I. Chen; Shou Chang Cheng; Sean Wu; Kwang Lung Lin

doi:10.1016/j.jallcom.2005.08.034

Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy

Kang I. Chen
, Shou Chang Cheng
, Sean Wu
, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

83 Citations (Scopus)

Abstract

The effects of a third elements, i.e., Ag, Al, and Ga, on melting temperature, microstructures, and mechanical properties of the Sn-9Zn lead-free solders were investigated. The results indicate that Ga is uniformly distributed in the Sn-matrix, Al is detected in the grain boundaries and Zn-rich phases, and Ag combines with Zn to form an Ag-Zn compound. The adding of 0.5 wt% Ag, results in decreasing the UTS and ductility. By the addition of Al the UTS and elongation of the Sn-9Zn-0.45Al alloy can be decreased due to the Al element precipitated in the grain boundaries. The Sn-9Zn-0.5Ga alloys have very good UTS and elongation, which are better than both those of the Sn-9Zn-0.5Ag and Sn-9Zn-0.45Al alloys.

Original language	English
Pages (from-to)	98-105
Number of pages	8
Journal	Journal of Alloys and Compounds
Volume	416
Issue number	1-2
DOIs	https://doi.org/10.1016/j.jallcom.2005.08.034
Publication status	Published - 2006 Jun 8

All Science Journal Classification (ASJC) codes

Mechanics of Materials
Mechanical Engineering
Metals and Alloys
Materials Chemistry

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10.1016/j.jallcom.2005.08.034

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@article{0ca033809633445e8fb058386414d8fd,

title = "Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy",

abstract = "The effects of a third elements, i.e., Ag, Al, and Ga, on melting temperature, microstructures, and mechanical properties of the Sn-9Zn lead-free solders were investigated. The results indicate that Ga is uniformly distributed in the Sn-matrix, Al is detected in the grain boundaries and Zn-rich phases, and Ag combines with Zn to form an Ag-Zn compound. The adding of 0.5 wt\% Ag, results in decreasing the UTS and ductility. By the addition of Al the UTS and elongation of the Sn-9Zn-0.45Al alloy can be decreased due to the Al element precipitated in the grain boundaries. The Sn-9Zn-0.5Ga alloys have very good UTS and elongation, which are better than both those of the Sn-9Zn-0.5Ag and Sn-9Zn-0.45Al alloys.",

author = "Chen, \{Kang I.\} and Cheng, \{Shou Chang\} and Sean Wu and Lin, \{Kwang Lung\}",

note = "Funding Information: Financial support of this work is from National Science Council of the Republic of China under NSC 92-2216-E-272-002 and is gratefully acknowledged.",

year = "2006",

month = jun,

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doi = "10.1016/j.jallcom.2005.08.034",

language = "English",

volume = "416",

pages = "98--105",

journal = "Journal of Alloys and Compounds",

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TY - JOUR

T1 - Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy

AU - Chen, Kang I.

AU - Cheng, Shou Chang

AU - Wu, Sean

AU - Lin, Kwang Lung

N1 - Funding Information: Financial support of this work is from National Science Council of the Republic of China under NSC 92-2216-E-272-002 and is gratefully acknowledged.

PY - 2006/6/8

Y1 - 2006/6/8

N2 - The effects of a third elements, i.e., Ag, Al, and Ga, on melting temperature, microstructures, and mechanical properties of the Sn-9Zn lead-free solders were investigated. The results indicate that Ga is uniformly distributed in the Sn-matrix, Al is detected in the grain boundaries and Zn-rich phases, and Ag combines with Zn to form an Ag-Zn compound. The adding of 0.5 wt% Ag, results in decreasing the UTS and ductility. By the addition of Al the UTS and elongation of the Sn-9Zn-0.45Al alloy can be decreased due to the Al element precipitated in the grain boundaries. The Sn-9Zn-0.5Ga alloys have very good UTS and elongation, which are better than both those of the Sn-9Zn-0.5Ag and Sn-9Zn-0.45Al alloys.

AB - The effects of a third elements, i.e., Ag, Al, and Ga, on melting temperature, microstructures, and mechanical properties of the Sn-9Zn lead-free solders were investigated. The results indicate that Ga is uniformly distributed in the Sn-matrix, Al is detected in the grain boundaries and Zn-rich phases, and Ag combines with Zn to form an Ag-Zn compound. The adding of 0.5 wt% Ag, results in decreasing the UTS and ductility. By the addition of Al the UTS and elongation of the Sn-9Zn-0.45Al alloy can be decreased due to the Al element precipitated in the grain boundaries. The Sn-9Zn-0.5Ga alloys have very good UTS and elongation, which are better than both those of the Sn-9Zn-0.5Ag and Sn-9Zn-0.45Al alloys.

UR - https://www.scopus.com/pages/publications/33646502594

UR - https://www.scopus.com/pages/publications/33646502594#tab=citedBy

U2 - 10.1016/j.jallcom.2005.08.034

DO - 10.1016/j.jallcom.2005.08.034

M3 - Article

AN - SCOPUS:33646502594

SN - 0925-8388

VL - 416

SP - 98

EP - 105

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

IS - 1-2

ER -

Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy

Abstract

All Science Journal Classification (ASJC) codes

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