Effects of static heat and dynamic current on Al/Zn·Cu/Sn Solder/Ag interfaces of Sn photovoltaic Al-ribbon modules

Kuan Jen Chen; Fei Yi Hung; Truan Sheng Lui; Wen Yu Lin

doi:10.3390/ma11091642

Effects of static heat and dynamic current on Al/Zn·Cu/Sn Solder/Ag interfaces of Sn photovoltaic Al-ribbon modules

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Wen Yu Lin

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

This present study applied Cu·Zn/Al ribbon in place of a traditional Cu ribbon to a photovoltaic (PV) ribbon. A hot-dipped and an electroplated Sn PV ribbon reflowed onto an Ag electrode on a Si solar cell and estimated the feasibility of the tested module (Ag/Solder/Cu·Zn/Al). After bias-aging, a bias-induced thermal diffusion and an electromigration promoted the growth of intermetallic compounds (IMCs) (Cu₆Sn₅, Ag₃Sn). To simulate a photo-generated current in the series connection of solar cells, an electron with Ag-direction (electron flows from Ag to Al) and Al-direction (electron flows from Al to Ag) was passed through the Al/Zn·Cu/Solder/Ag structure to clarify the growth mechanism of IMCs. An increase in resistance of the Ag-direction-biased module was higher than that of the Al-direction biased one due to the intense growth of Cu₆Sn₅ and Ag₃Sn IMCs. The coated solder of the electroplated PV ribbon was less than that of the hot-dipped one, and thus decreased the growth reaction of IMCs and the cost of PV ribbon.

Original language	English
Article number	1642
Journal	Materials
Volume	11
Issue number	9
DOIs	https://doi.org/10.3390/ma11091642
Publication status	Published - 2018 Sept 7

All Science Journal Classification (ASJC) codes

Condensed Matter Physics
Materials Science(all)

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@article{bfcf03db8e044603bb2237e47752f866,

title = "Effects of static heat and dynamic current on Al/Zn·Cu/Sn Solder/Ag interfaces of Sn photovoltaic Al-ribbon modules",

abstract = "This present study applied Cu·Zn/Al ribbon in place of a traditional Cu ribbon to a photovoltaic (PV) ribbon. A hot-dipped and an electroplated Sn PV ribbon reflowed onto an Ag electrode on a Si solar cell and estimated the feasibility of the tested module (Ag/Solder/Cu·Zn/Al). After bias-aging, a bias-induced thermal diffusion and an electromigration promoted the growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn). To simulate a photo-generated current in the series connection of solar cells, an electron with Ag-direction (electron flows from Ag to Al) and Al-direction (electron flows from Al to Ag) was passed through the Al/Zn·Cu/Solder/Ag structure to clarify the growth mechanism of IMCs. An increase in resistance of the Ag-direction-biased module was higher than that of the Al-direction biased one due to the intense growth of Cu6Sn5 and Ag3Sn IMCs. The coated solder of the electroplated PV ribbon was less than that of the hot-dipped one, and thus decreased the growth reaction of IMCs and the cost of PV ribbon.",

author = "Chen, {Kuan Jen} and Hung, {Fei Yi} and Lui, {Truan Sheng} and Lin, {Wen Yu}",

note = "Funding Information: The authors are grateful to Ministry of Science and Technology (MOST) Instrument Center at National Cheng Kung University (NCKU) and MOST, Taiwan for financially supporting this study under grant numbers MOST 106-2221-E-006-064. This research was funded by the Ministry of Science and Technology, grant number MOST 106-2221-E-006-064. Publisher Copyright: {\textcopyright} 2018 by the authors.",

year = "2018",

month = sep,

day = "7",

doi = "10.3390/ma11091642",

language = "English",

volume = "11",

journal = "Materials",

issn = "1996-1944",

publisher = "MDPI AG",

number = "9",

}

TY - JOUR

T1 - Effects of static heat and dynamic current on Al/Zn·Cu/Sn Solder/Ag interfaces of Sn photovoltaic Al-ribbon modules

AU - Chen, Kuan Jen

AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Lin, Wen Yu

N1 - Funding Information: The authors are grateful to Ministry of Science and Technology (MOST) Instrument Center at National Cheng Kung University (NCKU) and MOST, Taiwan for financially supporting this study under grant numbers MOST 106-2221-E-006-064. This research was funded by the Ministry of Science and Technology, grant number MOST 106-2221-E-006-064. Publisher Copyright: © 2018 by the authors.

PY - 2018/9/7

Y1 - 2018/9/7

N2 - This present study applied Cu·Zn/Al ribbon in place of a traditional Cu ribbon to a photovoltaic (PV) ribbon. A hot-dipped and an electroplated Sn PV ribbon reflowed onto an Ag electrode on a Si solar cell and estimated the feasibility of the tested module (Ag/Solder/Cu·Zn/Al). After bias-aging, a bias-induced thermal diffusion and an electromigration promoted the growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn). To simulate a photo-generated current in the series connection of solar cells, an electron with Ag-direction (electron flows from Ag to Al) and Al-direction (electron flows from Al to Ag) was passed through the Al/Zn·Cu/Solder/Ag structure to clarify the growth mechanism of IMCs. An increase in resistance of the Ag-direction-biased module was higher than that of the Al-direction biased one due to the intense growth of Cu6Sn5 and Ag3Sn IMCs. The coated solder of the electroplated PV ribbon was less than that of the hot-dipped one, and thus decreased the growth reaction of IMCs and the cost of PV ribbon.

AB - This present study applied Cu·Zn/Al ribbon in place of a traditional Cu ribbon to a photovoltaic (PV) ribbon. A hot-dipped and an electroplated Sn PV ribbon reflowed onto an Ag electrode on a Si solar cell and estimated the feasibility of the tested module (Ag/Solder/Cu·Zn/Al). After bias-aging, a bias-induced thermal diffusion and an electromigration promoted the growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn). To simulate a photo-generated current in the series connection of solar cells, an electron with Ag-direction (electron flows from Ag to Al) and Al-direction (electron flows from Al to Ag) was passed through the Al/Zn·Cu/Solder/Ag structure to clarify the growth mechanism of IMCs. An increase in resistance of the Ag-direction-biased module was higher than that of the Al-direction biased one due to the intense growth of Cu6Sn5 and Ag3Sn IMCs. The coated solder of the electroplated PV ribbon was less than that of the hot-dipped one, and thus decreased the growth reaction of IMCs and the cost of PV ribbon.

UR - http://www.scopus.com/inward/record.url?scp=85052928999&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85052928999&partnerID=8YFLogxK

U2 - 10.3390/ma11091642

DO - 10.3390/ma11091642

M3 - Article

AN - SCOPUS:85052928999

SN - 1996-1944

VL - 11

JO - Materials

JF - Materials

IS - 9

M1 - 1642

ER -

Effects of static heat and dynamic current on Al/Zn·Cu/Sn Solder/Ag interfaces of Sn photovoltaic Al-ribbon modules

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