Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

Alaric Yohei Kawai Pétillot; Shuichi Shoji; Hiroshi Kawarada; Jun Mizuno

doi:10.23919/ICEP58572.2023.10129767

Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

Alaric Yohei Kawai Pétillot, Shuichi Shoji, Hiroshi Kawarada, Jun Mizuno

Program on Smart and Sustainable Manufacturing

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.

Original language	English
Title of host publication	2023 International Conference on Electronics Packaging, ICEP 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	31-32
Number of pages	2
ISBN (Electronic)	9784991191152
DOIs	https://doi.org/10.23919/ICEP58572.2023.10129767
Publication status	Published - 2023
Event	22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan Duration: 2023 Apr 19 → 2023 Apr 22

Publication series

Name	2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference	22nd International Conference on Electronics Packaging, ICEP 2023
Country/Territory	Japan
City	Kumamoto
Period	23-04-19 → 23-04-22

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Mechanics of Materials
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

Access to Document

10.23919/ICEP58572.2023.10129767

Cite this

Pétillot, A. Y. K., Shoji, S., Kawarada, H., & Mizuno, J. (2023). Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. In 2023 International Conference on Electronics Packaging, ICEP 2023 (pp. 31-32). (2023 International Conference on Electronics Packaging, ICEP 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP58572.2023.10129767

Pétillot, Alaric Yohei Kawai ; Shoji, Shuichi ; Kawarada, Hiroshi et al. / Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 31-32 (2023 International Conference on Electronics Packaging, ICEP 2023).

@inproceedings{77cdbf6ac6f540f8afd1c5e5bc49dfa5,

title = "Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer",

abstract = "Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.",

author = "P{\'e}tillot, {Alaric Yohei Kawai} and Shuichi Shoji and Hiroshi Kawarada and Jun Mizuno",

note = "Publisher Copyright: {\textcopyright} 2023 Japan Institute of Electronics Packaging.; 22nd International Conference on Electronics Packaging, ICEP 2023 ; Conference date: 19-04-2023 Through 22-04-2023",

year = "2023",

doi = "10.23919/ICEP58572.2023.10129767",

language = "English",

series = "2023 International Conference on Electronics Packaging, ICEP 2023",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "31--32",

booktitle = "2023 International Conference on Electronics Packaging, ICEP 2023",

address = "United States",

}

Pétillot, AYK, Shoji, S, Kawarada, H & Mizuno, J 2023, Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. in 2023 International Conference on Electronics Packaging, ICEP 2023. 2023 International Conference on Electronics Packaging, ICEP 2023, Institute of Electrical and Electronics Engineers Inc., pp. 31-32, 22nd International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 23-04-19. https://doi.org/10.23919/ICEP58572.2023.10129767

Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. / Pétillot, Alaric Yohei Kawai; Shoji, Shuichi; Kawarada, Hiroshi et al.
2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 31-32 (2023 International Conference on Electronics Packaging, ICEP 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

AU - Pétillot, Alaric Yohei Kawai

AU - Shoji, Shuichi

AU - Kawarada, Hiroshi

AU - Mizuno, Jun

PY - 2023

Y1 - 2023

N2 - Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.

AB - Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.

UR - http://www.scopus.com/inward/record.url?scp=85161845757&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85161845757&partnerID=8YFLogxK

U2 - 10.23919/ICEP58572.2023.10129767

DO - 10.23919/ICEP58572.2023.10129767

M3 - Conference contribution

AN - SCOPUS:85161845757

T3 - 2023 International Conference on Electronics Packaging, ICEP 2023

SP - 31

EP - 32

BT - 2023 International Conference on Electronics Packaging, ICEP 2023

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 22nd International Conference on Electronics Packaging, ICEP 2023

Y2 - 19 April 2023 through 22 April 2023

ER -

Pétillot AYK, Shoji S, Kawarada H, Mizuno J. Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. In 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 31-32. (2023 International Conference on Electronics Packaging, ICEP 2023). doi: 10.23919/ICEP58572.2023.10129767

Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

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