The morhological and interfacial characteristics of Cu/SiO2/<Si>, Cu(0.02 wt% Ti)/SiO2/<Si>, and Cu(2.98 wt% Ti)/SiO2/<Si> systems upon vacuum annealing were studied. It was found that the Cu(2.98 wt% Ti) film exhibits strong <111> texture, small grain size, and smooth surface after heat treatment.
|Number of pages||6|
|Journal||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures|
|Publication status||Published - 2002 Nov 1|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering