Effects of vacuum ultraviolet surface treatment on the bonding interconnections for flip chip and 3-D integration

  • Katsuyuki Sakuma
  • , Jun Mizuno
  • , Noriyasu Nagai
  • , Naoko Unami
  • , Shuichi Shoji

Research output: Contribution to journal › Article › peer-review

18 Citations (Scopus)

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Engineering

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