Effects of wall conduction and interface thermal resistance on the phase-change problem

Chi Chuan Hwang, Senpuu Lin, Li Fu Shen

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

Perturbation solutions for the phase-change problem during solidification involving the wall conduction and wall-material interfacial thermal contact resistance boundary condition are presented in a straightforward approximate analytical manner. Comparison is made between the present result and those in the case with neglecting the effects of wall-material interfacial thermal resistance and/or wall conduction. It is found that the solidification rate increases with decreasing wall-material interfacial thermal resistance, or increasing Stefan number, or decreasing the ratio of solidified-material thermal conductivity to wall thermal conductivity.

Original languageEnglish
Pages (from-to)1849-1855
Number of pages7
JournalInternational Journal of Heat and Mass Transfer
Volume37
Issue number13
DOIs
Publication statusPublished - 1994 Sep

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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