Effects of wall conduction and interface thermal resistance on the phase-change problem

Chi Chuan Hwang; Senpuu Lin; Li Fu Shen

doi:10.1016/0017-9310(94)90325-5

Effects of wall conduction and interface thermal resistance on the phase-change problem

Chi Chuan Hwang, Senpuu Lin, Li Fu Shen

Department of Engineering Science

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

Perturbation solutions for the phase-change problem during solidification involving the wall conduction and wall-material interfacial thermal contact resistance boundary condition are presented in a straightforward approximate analytical manner. Comparison is made between the present result and those in the case with neglecting the effects of wall-material interfacial thermal resistance and/or wall conduction. It is found that the solidification rate increases with decreasing wall-material interfacial thermal resistance, or increasing Stefan number, or decreasing the ratio of solidified-material thermal conductivity to wall thermal conductivity.

Original language	English
Pages (from-to)	1849-1855
Number of pages	7
Journal	International Journal of Heat and Mass Transfer
Volume	37
Issue number	13
DOIs	https://doi.org/10.1016/0017-9310(94)90325-5
Publication status	Published - 1994 Sep

All Science Journal Classification (ASJC) codes

Condensed Matter Physics
Mechanical Engineering
Fluid Flow and Transfer Processes

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abstract = "Perturbation solutions for the phase-change problem during solidification involving the wall conduction and wall-material interfacial thermal contact resistance boundary condition are presented in a straightforward approximate analytical manner. Comparison is made between the present result and those in the case with neglecting the effects of wall-material interfacial thermal resistance and/or wall conduction. It is found that the solidification rate increases with decreasing wall-material interfacial thermal resistance, or increasing Stefan number, or decreasing the ratio of solidified-material thermal conductivity to wall thermal conductivity.",

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AU - Hwang, Chi Chuan

AU - Lin, Senpuu

AU - Shen, Li Fu

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N2 - Perturbation solutions for the phase-change problem during solidification involving the wall conduction and wall-material interfacial thermal contact resistance boundary condition are presented in a straightforward approximate analytical manner. Comparison is made between the present result and those in the case with neglecting the effects of wall-material interfacial thermal resistance and/or wall conduction. It is found that the solidification rate increases with decreasing wall-material interfacial thermal resistance, or increasing Stefan number, or decreasing the ratio of solidified-material thermal conductivity to wall thermal conductivity.

AB - Perturbation solutions for the phase-change problem during solidification involving the wall conduction and wall-material interfacial thermal contact resistance boundary condition are presented in a straightforward approximate analytical manner. Comparison is made between the present result and those in the case with neglecting the effects of wall-material interfacial thermal resistance and/or wall conduction. It is found that the solidification rate increases with decreasing wall-material interfacial thermal resistance, or increasing Stefan number, or decreasing the ratio of solidified-material thermal conductivity to wall thermal conductivity.

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JF - International Journal of Heat and Mass Transfer

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ER -

Effects of wall conduction and interface thermal resistance on the phase-change problem

Abstract

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