TY - JOUR
T1 - Efficient modeling of heat conduction in multiply bonded composites covered with thermal barrier coating
AU - Shiah, Y. C.
AU - Hsiao, Yue Fang
AU - Hematiyan, Mohammad Rahim
N1 - Publisher Copyright:
© 2024
PY - 2024/7
Y1 - 2024/7
N2 - In engineering practice, 3D (three-dimensional) composites consisting of multiply thin layers of anisotropic materials have been extensively applied. For enhancing their thermal endurance, the composites are often coated with a very thin layer of medium with low conductivity, usually referred to as the thermal barrier coating (TBC). This paper presents an efficient algorithm for the boundary element method (BEM) to accurately compute the nearly singular integrals in modeling 3D anisotropic heat conduction in TBC-coated composites, consisting of several thin anisotropic media. This algorithm is especially efficient because no analytical transformation of the integrands is involved as proposed in the past. When the TBC is prescribed with Dirichlet condition, a new equivalent convective condition is proposed to replace the TBC modeling. Moreover, thin films of adhesives on interfaces are considered by introducing interfacial conductance. In the end, several examples are presented.
AB - In engineering practice, 3D (three-dimensional) composites consisting of multiply thin layers of anisotropic materials have been extensively applied. For enhancing their thermal endurance, the composites are often coated with a very thin layer of medium with low conductivity, usually referred to as the thermal barrier coating (TBC). This paper presents an efficient algorithm for the boundary element method (BEM) to accurately compute the nearly singular integrals in modeling 3D anisotropic heat conduction in TBC-coated composites, consisting of several thin anisotropic media. This algorithm is especially efficient because no analytical transformation of the integrands is involved as proposed in the past. When the TBC is prescribed with Dirichlet condition, a new equivalent convective condition is proposed to replace the TBC modeling. Moreover, thin films of adhesives on interfaces are considered by introducing interfacial conductance. In the end, several examples are presented.
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U2 - 10.1016/j.enganabound.2024.105763
DO - 10.1016/j.enganabound.2024.105763
M3 - Article
AN - SCOPUS:85192448832
SN - 0955-7997
VL - 164
JO - Engineering Analysis with Boundary Elements
JF - Engineering Analysis with Boundary Elements
M1 - 105763
ER -