Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package

Yu Chieh Huang, Bing Yang Lin, Cheng Wen Wu, Mincent Lee, Hao Chen, Hung Chih Lin, Ching Nen Peng, Min Jer Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

With the increasing demand of super high scale of integration and small form factor in advanced semiconductor products, especially those that integrate DRAM and logic dies, 3D IC and Wafer-Level Chip-Scale Packaging (WLCSP) are considered promising approaches. In Integrated Fan-Out (InFO) WLCSP, a large number of fine-pitch pads, where neighboring pads cannot be probed simultaneously due to insufficient pitch, are used as the contact interfaces of inter-die interconnections. If the fine-pitch pads cannot be probed, the interconnections between the pads and boundary scan cells (BSCs) cannot be tested, which can lead to higher defect level. From industrial investigation, untested fine-pitch pads lead to 1-2% test coverage loss. To improve the overall test coverage, in this paper, we propose a pre-bond probing methodology for fine-pitch pads of InFO WLCSP. By the proposed probing schemes, open/short faults on the interconnects between the fine-pitch pads and BSCs can be all tested by the ATE. Moreover, for short faults that only occur between adjacent pads (interconnects), we propose a grouping method to determine the test patterns at each probing stage, which can minimize the test time. We also show that our method can achieve 100% test coverage of open/short faults.

Original languageEnglish
Title of host publicationProceedings of the 53rd Annual Design Automation Conference, DAC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781450342360
DOIs
Publication statusPublished - 2016 Jun 5
Event53rd Annual ACM IEEE Design Automation Conference, DAC 2016 - Austin, United States
Duration: 2016 Jun 52016 Jun 9

Publication series

NameProceedings - Design Automation Conference
Volume05-09-June-2016
ISSN (Print)0738-100X

Conference

Conference53rd Annual ACM IEEE Design Automation Conference, DAC 2016
CountryUnited States
CityAustin
Period16-06-0516-06-09

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Modelling and Simulation

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    Huang, Y. C., Lin, B. Y., Wu, C. W., Lee, M., Chen, H., Lin, H. C., Peng, C. N., & Wang, M. J. (2016). Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package. In Proceedings of the 53rd Annual Design Automation Conference, DAC 2016 [a58] (Proceedings - Design Automation Conference; Vol. 05-09-June-2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1145/2897937.2898015