TY - JOUR
T1 - Efficient Spin-Orbit Torque Switching of Perpendicular Magnetization using Topological Insulators with High Thermal Tolerance
AU - Pan, Quanjun
AU - Liu, Yuting
AU - Wu, Hao
AU - Zhang, Peng
AU - Huang, Hanshen
AU - Eckberg, Christopher
AU - Che, Xiaoyu
AU - Wu, Yingying
AU - Dai, Bingqian
AU - Shao, Qiming
AU - Wang, Kang L.
N1 - Publisher Copyright:
© 2022 Wiley-VCH GmbH.
PY - 2022/9
Y1 - 2022/9
N2 - Recent advances in using topological insulators (TIs) with ferromagnets (FMs) at room temperature have opened an innovative avenue in spin-orbit torque (SOT) nonvolatile magnetic memory and low dissipation electronics. However, direct integration of TIs with perpendicularly magnetized FM, while retaining an extraordinary charge-to-spin conversion efficiency (>100%), remains a major challenge. In addition, the indispensable thermal compatibility with modern CMOS technologies has not yet been demonstrated in TI-based structures. Here, high-quality integration of a perpendicularly magnetized CoFeB/MgO system with TI through a Mo insertion layer is achieved and efficient current-induced magnetization switching at ambient temperature is demonstrated. The calibrated energy efficiency of TIs is at least 1 order magnitude larger than those found in heavy metals. Moreover, it is demonstrated that the perpendicular anisotropy of the integrated CoFeB/MgO system and the current-induced magnetization switching behavior are well-preserved after annealing at >350 °C, offering a wide temperature window for thermal treatments. This thermal compatibility with the modern CMOS back-end-of-line process achieved in these TI-based structures paves the way toward TI-based low-dissipation spintronic applications.
AB - Recent advances in using topological insulators (TIs) with ferromagnets (FMs) at room temperature have opened an innovative avenue in spin-orbit torque (SOT) nonvolatile magnetic memory and low dissipation electronics. However, direct integration of TIs with perpendicularly magnetized FM, while retaining an extraordinary charge-to-spin conversion efficiency (>100%), remains a major challenge. In addition, the indispensable thermal compatibility with modern CMOS technologies has not yet been demonstrated in TI-based structures. Here, high-quality integration of a perpendicularly magnetized CoFeB/MgO system with TI through a Mo insertion layer is achieved and efficient current-induced magnetization switching at ambient temperature is demonstrated. The calibrated energy efficiency of TIs is at least 1 order magnitude larger than those found in heavy metals. Moreover, it is demonstrated that the perpendicular anisotropy of the integrated CoFeB/MgO system and the current-induced magnetization switching behavior are well-preserved after annealing at >350 °C, offering a wide temperature window for thermal treatments. This thermal compatibility with the modern CMOS back-end-of-line process achieved in these TI-based structures paves the way toward TI-based low-dissipation spintronic applications.
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U2 - 10.1002/aelm.202200003
DO - 10.1002/aelm.202200003
M3 - Article
AN - SCOPUS:85129839593
SN - 2199-160X
VL - 8
JO - Advanced Electronic Materials
JF - Advanced Electronic Materials
IS - 9
M1 - 2200003
ER -