Elastic properties of self-supported circular thin copper films calculated from equilibrium thermal vibration

Hsi Hung Chang, Chi-Chuan Hwang, Yue Ling Shen

Research output: Contribution to journalArticle

Abstract

Thermomechanical vibration of ultrathin, self-supported copper films due to thermal fluctuations is studied via the molecular dynamics simulation at room temperature. The elastodynamic theory with pre-stress is adopted to extract the physical properties of the films by comparing with the molecular dynamics data. The edge-clamped circular films consist of several atomic layers of fcc copper with the [100] direction normal to the film surface. From the time-history trajectories of atoms and their Fourier frequency spectrums, it was found that the fundamental resonant frequency non-monotonically varies with the film thickness due to the existence of residual stress in the film. Multiple resonant modes are adopted for modulus calculation and residual stress determination. The value of Young's modulus increases with increasing thickness of the film and the residual stress decreases with increasing thickness. Thicker films exhibit less residual stress, indicating the equilibrium distance between copper atoms changes with the film thickness.

Original languageEnglish
Pages (from-to)4846-4851
Number of pages6
JournalJournal of Nanoscience and Nanotechnology
Volume11
Issue number6
DOIs
Publication statusPublished - 2011

Fingerprint

Vibration
Copper
elastic properties
Hot Temperature
Molecular Dynamics Simulation
copper
vibration
residual stress
Residual stresses
Elastic Modulus
Film thickness
Molecular dynamics
film thickness
History
molecular dynamics
elastodynamics
Atoms
Temperature
stress analysis
Thick films

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Chemistry(all)
  • Materials Science(all)
  • Bioengineering
  • Biomedical Engineering

Cite this

@article{f72ef98cef394b38a0636eae1ea73d0e,
title = "Elastic properties of self-supported circular thin copper films calculated from equilibrium thermal vibration",
abstract = "Thermomechanical vibration of ultrathin, self-supported copper films due to thermal fluctuations is studied via the molecular dynamics simulation at room temperature. The elastodynamic theory with pre-stress is adopted to extract the physical properties of the films by comparing with the molecular dynamics data. The edge-clamped circular films consist of several atomic layers of fcc copper with the [100] direction normal to the film surface. From the time-history trajectories of atoms and their Fourier frequency spectrums, it was found that the fundamental resonant frequency non-monotonically varies with the film thickness due to the existence of residual stress in the film. Multiple resonant modes are adopted for modulus calculation and residual stress determination. The value of Young's modulus increases with increasing thickness of the film and the residual stress decreases with increasing thickness. Thicker films exhibit less residual stress, indicating the equilibrium distance between copper atoms changes with the film thickness.",
author = "Chang, {Hsi Hung} and Chi-Chuan Hwang and Shen, {Yue Ling}",
year = "2011",
doi = "10.1166/jnn.2011.4126",
language = "English",
volume = "11",
pages = "4846--4851",
journal = "Journal of Nanoscience and Nanotechnology",
issn = "1533-4880",
publisher = "American Scientific Publishers",
number = "6",

}

Elastic properties of self-supported circular thin copper films calculated from equilibrium thermal vibration. / Chang, Hsi Hung; Hwang, Chi-Chuan; Shen, Yue Ling.

In: Journal of Nanoscience and Nanotechnology, Vol. 11, No. 6, 2011, p. 4846-4851.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Elastic properties of self-supported circular thin copper films calculated from equilibrium thermal vibration

AU - Chang, Hsi Hung

AU - Hwang, Chi-Chuan

AU - Shen, Yue Ling

PY - 2011

Y1 - 2011

N2 - Thermomechanical vibration of ultrathin, self-supported copper films due to thermal fluctuations is studied via the molecular dynamics simulation at room temperature. The elastodynamic theory with pre-stress is adopted to extract the physical properties of the films by comparing with the molecular dynamics data. The edge-clamped circular films consist of several atomic layers of fcc copper with the [100] direction normal to the film surface. From the time-history trajectories of atoms and their Fourier frequency spectrums, it was found that the fundamental resonant frequency non-monotonically varies with the film thickness due to the existence of residual stress in the film. Multiple resonant modes are adopted for modulus calculation and residual stress determination. The value of Young's modulus increases with increasing thickness of the film and the residual stress decreases with increasing thickness. Thicker films exhibit less residual stress, indicating the equilibrium distance between copper atoms changes with the film thickness.

AB - Thermomechanical vibration of ultrathin, self-supported copper films due to thermal fluctuations is studied via the molecular dynamics simulation at room temperature. The elastodynamic theory with pre-stress is adopted to extract the physical properties of the films by comparing with the molecular dynamics data. The edge-clamped circular films consist of several atomic layers of fcc copper with the [100] direction normal to the film surface. From the time-history trajectories of atoms and their Fourier frequency spectrums, it was found that the fundamental resonant frequency non-monotonically varies with the film thickness due to the existence of residual stress in the film. Multiple resonant modes are adopted for modulus calculation and residual stress determination. The value of Young's modulus increases with increasing thickness of the film and the residual stress decreases with increasing thickness. Thicker films exhibit less residual stress, indicating the equilibrium distance between copper atoms changes with the film thickness.

UR - http://www.scopus.com/inward/record.url?scp=84861112414&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84861112414&partnerID=8YFLogxK

U2 - 10.1166/jnn.2011.4126

DO - 10.1166/jnn.2011.4126

M3 - Article

VL - 11

SP - 4846

EP - 4851

JO - Journal of Nanoscience and Nanotechnology

JF - Journal of Nanoscience and Nanotechnology

SN - 1533-4880

IS - 6

ER -