Electric contact resistance for monitoring nanoindentation-induced delamination

Huu Hung Nguyen, Pal Jen Wei, Jen Fin Lin

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Abstract

This study applied an in situ electric contact resistance technique to monitor delamination induced by indentation loads. A suddenly increasing indentation depth, together with a simultaneous drop in monitoring contact current, suggests that delamination occurred. During unloading processes, the rapid decrease in both contact depth and current imply that the delaminated film was suspended as long as the indentation load became sufficiently small. When delamination occurred during oscillating processes, the contact current was found to drop from an initial value to a steady value, which is related to a loss of interfacial contact.

Original languageEnglish
Article number015007
JournalAdvances in Natural Sciences: Nanoscience and Nanotechnology
Volume2
Issue number1
DOIs
Publication statusPublished - 2011 Mar

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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