This study applied an in situ electric contact resistance technique to monitor delamination induced by indentation loads. A suddenly increasing indentation depth, together with a simultaneous drop in monitoring contact current, suggests that delamination occurred. During unloading processes, the rapid decrease in both contact depth and current imply that the delaminated film was suspended as long as the indentation load became sufficiently small. When delamination occurred during oscillating processes, the contact current was found to drop from an initial value to a steady value, which is related to a loss of interfacial contact.
|Journal||Advances in Natural Sciences: Nanoscience and Nanotechnology|
|Publication status||Published - 2011 Mar|
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering