TY - GEN
T1 - Electric current-induced plastic deformation
T2 - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
AU - Liu, Yu Chen
AU - Lin, Shih Kang
N1 - Publisher Copyright:
© 2018 Japan Institute of Electronics Packaging.
Copyright:
Copyright 2018 Elsevier B.V., All rights reserved.
PY - 2018/6/6
Y1 - 2018/6/6
N2 - Recent study has shown that electron flow would induce a non-uniform lattice strain along the strip and the electric current stress-induced deformation is suggested to have the same context with the conventional solid mechanics' theory. The electromigration (EM) effect is thus suggested to be a local stress relaxation at the condition beyond the critical point. In this study, in situ current stressing experiment with synchrotron radiation-based XRD and in situ SEM equipped with EBSD system were employed to investigate the electric current-induced plastic deformation. The results revealed that at a relatively higher level of current density and the corresponding lattice strain, twinning accompanied with the voids/hillocks formation would be found. When slightly decreasing the current density, no twinning but only voids/hillocks formation could be found. The authors hope this study will advance the knowledge of electric current-induced plastic deformation and provide a further guideline for EM-resistant materials.
AB - Recent study has shown that electron flow would induce a non-uniform lattice strain along the strip and the electric current stress-induced deformation is suggested to have the same context with the conventional solid mechanics' theory. The electromigration (EM) effect is thus suggested to be a local stress relaxation at the condition beyond the critical point. In this study, in situ current stressing experiment with synchrotron radiation-based XRD and in situ SEM equipped with EBSD system were employed to investigate the electric current-induced plastic deformation. The results revealed that at a relatively higher level of current density and the corresponding lattice strain, twinning accompanied with the voids/hillocks formation would be found. When slightly decreasing the current density, no twinning but only voids/hillocks formation could be found. The authors hope this study will advance the knowledge of electric current-induced plastic deformation and provide a further guideline for EM-resistant materials.
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U2 - 10.23919/ICEP.2018.8374702
DO - 10.23919/ICEP.2018.8374702
M3 - Conference contribution
AN - SCOPUS:85048749247
T3 - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
SP - 197
EP - 198
BT - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 17 April 2018 through 21 April 2018
ER -