Electrical characteristics of nMOSFETs fabricated on hybrid orientation substrate with amorphization/templated recrystallization method

Po Chin Huang, San Lein Wu, Shoou Jinn Chang, Yao Tsung Huang, Chien Ting Lin, Mike Ma, Osbert Cheng

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The use of hybrid orientation technology (HOT) with direct silicon bond (DSB) wafers consisting of a (1 1 0) crystal orientation layer bonded to a bulk (1 0 0) handle wafer provides promising opportunities for easier migration of bulk CMOS designs to higher performance materials. However, the material quality of nMOSFETs regions, which has been undergone amorphization/templated recrystallization (ATR) process for transforming the Si surface into (1 0 0) orientation, is still a concern because the ATR-induced defects (i.e., dislocation loops or threads) at the recrystallization layer, could degrade gate oxide integrity. In this paper, we report an investigation of charge pumping and low-frequency (1/f) noise in HOT nMOSFETs. Devices with the increased anneal time brought out a significant reduction in the charge pumping current and 1/f noise, which indicates ATR-induced defects were suppressed and consequently the "low-trap-density" of the Si/SiO2 interface. Finally, for the first time, the behavior of 1/f noise for HOT nMOSFETs was investigated, and could be described by a unified model, i.e. a combination of carrier-number fluctuations and mobility fluctuations.

Original languageEnglish
Pages (from-to)662-665
Number of pages4
JournalMicroelectronics Reliability
Volume50
Issue number5
DOIs
Publication statusPublished - 2010 May

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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