Electrical characterization of BGA test socket for high-speed applications

Ming Kun Chen, Cheng-Chi Tai, Yu Jung Huang, Li Kuei Fang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

This paper discusses the electrical characterization of a high-density and high-speed BGA (ball grid array) socket. The socket is built from copper-clad pogo pins and pinned in a 32 x 32 mm array with 400 pins on a 1.27 mm pitch. It provides power/ground array, and signal pins designed to offer 348 signal lines. The socket-base dielectric has a dielectric constant of about 4.2. The BGA test socket discussed in the paper is being targeted for high-speed testing fixture applications and their pins are closely spaced. Extensive TDR (time domain reflectometry) measurements and IPA510 simulations have been used to extract their significant electrical properties such as differential skews, characteristic impedances, reflection characteristics, and crosstalk. The bandwidth of the BGA socket from the 3 dB return loss criteria was calculated to be around 5 GHz for time domain measurements.

Original languageEnglish
Title of host publicationProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages123-126
Number of pages4
ISBN (Electronic)078037682X, 9780780376823
DOIs
Publication statusPublished - 2002 Jan 1
Event4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan
Duration: 2002 Dec 42002 Dec 6

Publication series

NameProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
CountryTaiwan
CityKaohsiung
Period02-12-0402-12-06

Fingerprint

Ball grid arrays
Crosstalk
Copper
Electric properties
Permittivity
Bandwidth
Testing

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

Cite this

Chen, M. K., Tai, C-C., Huang, Y. J., & Fang, L. K. (2002). Electrical characterization of BGA test socket for high-speed applications. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (pp. 123-126). [1188824] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188824
Chen, Ming Kun ; Tai, Cheng-Chi ; Huang, Yu Jung ; Fang, Li Kuei. / Electrical characterization of BGA test socket for high-speed applications. Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 123-126 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).
@inproceedings{6a3c46e8bb964521a756463f086d62e2,
title = "Electrical characterization of BGA test socket for high-speed applications",
abstract = "This paper discusses the electrical characterization of a high-density and high-speed BGA (ball grid array) socket. The socket is built from copper-clad pogo pins and pinned in a 32 x 32 mm array with 400 pins on a 1.27 mm pitch. It provides power/ground array, and signal pins designed to offer 348 signal lines. The socket-base dielectric has a dielectric constant of about 4.2. The BGA test socket discussed in the paper is being targeted for high-speed testing fixture applications and their pins are closely spaced. Extensive TDR (time domain reflectometry) measurements and IPA510 simulations have been used to extract their significant electrical properties such as differential skews, characteristic impedances, reflection characteristics, and crosstalk. The bandwidth of the BGA socket from the 3 dB return loss criteria was calculated to be around 5 GHz for time domain measurements.",
author = "Chen, {Ming Kun} and Cheng-Chi Tai and Huang, {Yu Jung} and Fang, {Li Kuei}",
year = "2002",
month = "1",
day = "1",
doi = "10.1109/EMAP.2002.1188824",
language = "English",
series = "Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "123--126",
booktitle = "Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002",
address = "United States",

}

Chen, MK, Tai, C-C, Huang, YJ & Fang, LK 2002, Electrical characterization of BGA test socket for high-speed applications. in Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002., 1188824, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Institute of Electrical and Electronics Engineers Inc., pp. 123-126, 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Kaohsiung, Taiwan, 02-12-04. https://doi.org/10.1109/EMAP.2002.1188824

Electrical characterization of BGA test socket for high-speed applications. / Chen, Ming Kun; Tai, Cheng-Chi; Huang, Yu Jung; Fang, Li Kuei.

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 123-126 1188824 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Electrical characterization of BGA test socket for high-speed applications

AU - Chen, Ming Kun

AU - Tai, Cheng-Chi

AU - Huang, Yu Jung

AU - Fang, Li Kuei

PY - 2002/1/1

Y1 - 2002/1/1

N2 - This paper discusses the electrical characterization of a high-density and high-speed BGA (ball grid array) socket. The socket is built from copper-clad pogo pins and pinned in a 32 x 32 mm array with 400 pins on a 1.27 mm pitch. It provides power/ground array, and signal pins designed to offer 348 signal lines. The socket-base dielectric has a dielectric constant of about 4.2. The BGA test socket discussed in the paper is being targeted for high-speed testing fixture applications and their pins are closely spaced. Extensive TDR (time domain reflectometry) measurements and IPA510 simulations have been used to extract their significant electrical properties such as differential skews, characteristic impedances, reflection characteristics, and crosstalk. The bandwidth of the BGA socket from the 3 dB return loss criteria was calculated to be around 5 GHz for time domain measurements.

AB - This paper discusses the electrical characterization of a high-density and high-speed BGA (ball grid array) socket. The socket is built from copper-clad pogo pins and pinned in a 32 x 32 mm array with 400 pins on a 1.27 mm pitch. It provides power/ground array, and signal pins designed to offer 348 signal lines. The socket-base dielectric has a dielectric constant of about 4.2. The BGA test socket discussed in the paper is being targeted for high-speed testing fixture applications and their pins are closely spaced. Extensive TDR (time domain reflectometry) measurements and IPA510 simulations have been used to extract their significant electrical properties such as differential skews, characteristic impedances, reflection characteristics, and crosstalk. The bandwidth of the BGA socket from the 3 dB return loss criteria was calculated to be around 5 GHz for time domain measurements.

UR - http://www.scopus.com/inward/record.url?scp=84966478694&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84966478694&partnerID=8YFLogxK

U2 - 10.1109/EMAP.2002.1188824

DO - 10.1109/EMAP.2002.1188824

M3 - Conference contribution

T3 - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

SP - 123

EP - 126

BT - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Chen MK, Tai C-C, Huang YJ, Fang LK. Electrical characterization of BGA test socket for high-speed applications. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 123-126. 1188824. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). https://doi.org/10.1109/EMAP.2002.1188824