Abstract
This paper discusses the electrical characterization of a high-density and high-speed BGA (ball grid array) socket. The socket is built from copper-clad pogo pins and pinned in a 32 x 32 mm array with 400 pins on a 1.27 mm pitch. It provides power/ground array, and signal pins designed to offer 348 signal lines. The socket-base dielectric has a dielectric constant of about 4.2. The BGA test socket discussed in the paper is being targeted for high-speed testing fixture applications and their pins are closely spaced. Extensive TDR (time domain reflectometry) measurements and IPA510 simulations have been used to extract their significant electrical properties such as differential skews, characteristic impedances, reflection characteristics, and crosstalk. The bandwidth of the BGA socket from the 3 dB return loss criteria was calculated to be around 5 GHz for time domain measurements.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 123-126 |
| Number of pages | 4 |
| ISBN (Electronic) | 078037682X, 9780780376823 |
| DOIs | |
| Publication status | Published - 2002 Jan 1 |
| Event | 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan Duration: 2002 Dec 4 → 2002 Dec 6 |
Publication series
| Name | Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 |
|---|
Other
| Other | 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 |
|---|---|
| Country | Taiwan |
| City | Kaohsiung |
| Period | 02-12-04 → 02-12-06 |
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All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Materials Science(all)
Cite this
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Electrical characterization of BGA test socket for high-speed applications. / Chen, Ming Kun; Tai, Cheng-Chi; Huang, Yu Jung; Fang, Li Kuei.
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 123-126 1188824 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Electrical characterization of BGA test socket for high-speed applications
AU - Chen, Ming Kun
AU - Tai, Cheng-Chi
AU - Huang, Yu Jung
AU - Fang, Li Kuei
PY - 2002/1/1
Y1 - 2002/1/1
N2 - This paper discusses the electrical characterization of a high-density and high-speed BGA (ball grid array) socket. The socket is built from copper-clad pogo pins and pinned in a 32 x 32 mm array with 400 pins on a 1.27 mm pitch. It provides power/ground array, and signal pins designed to offer 348 signal lines. The socket-base dielectric has a dielectric constant of about 4.2. The BGA test socket discussed in the paper is being targeted for high-speed testing fixture applications and their pins are closely spaced. Extensive TDR (time domain reflectometry) measurements and IPA510 simulations have been used to extract their significant electrical properties such as differential skews, characteristic impedances, reflection characteristics, and crosstalk. The bandwidth of the BGA socket from the 3 dB return loss criteria was calculated to be around 5 GHz for time domain measurements.
AB - This paper discusses the electrical characterization of a high-density and high-speed BGA (ball grid array) socket. The socket is built from copper-clad pogo pins and pinned in a 32 x 32 mm array with 400 pins on a 1.27 mm pitch. It provides power/ground array, and signal pins designed to offer 348 signal lines. The socket-base dielectric has a dielectric constant of about 4.2. The BGA test socket discussed in the paper is being targeted for high-speed testing fixture applications and their pins are closely spaced. Extensive TDR (time domain reflectometry) measurements and IPA510 simulations have been used to extract their significant electrical properties such as differential skews, characteristic impedances, reflection characteristics, and crosstalk. The bandwidth of the BGA socket from the 3 dB return loss criteria was calculated to be around 5 GHz for time domain measurements.
UR - http://www.scopus.com/inward/record.url?scp=84966478694&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84966478694&partnerID=8YFLogxK
U2 - 10.1109/EMAP.2002.1188824
DO - 10.1109/EMAP.2002.1188824
M3 - Conference contribution
T3 - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
SP - 123
EP - 126
BT - Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PB - Institute of Electrical and Electronics Engineers Inc.
ER -