Electrical failure analysis of peristaltic micropumps fabricated with PZT actuators

Bing Liang Chen, Pao Cheng Huang, Ling-Sheng Jang, Ming Kun Chen

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A detection method based on electrical analysis for valveless peristaltic lead zirconate titanate (PZT) micropump fabrication is proposed. The modified Butterworth-Van Dyke (BVD) model is used to analyze the properties of resistant or capacitive elements related to various failures. The series resistance and parallel capacitance in the BVD model are used to detect faults and classify the failure type. The failure analysis of the micropump assembly process focuses on the three common failures: (a) PZT cracking, (b) uneven silver epoxy distribution, and (c) PZT inversion. The analysis approach combines experimental results with a circuit model to determine PZT micropump fabrication reliability. It can be used to detect defects in peristaltic PZT micropumps and classify failure type.

Original languageEnglish
Pages (from-to)1080-1085
Number of pages6
JournalMicroelectronics Reliability
Volume52
Issue number6
DOIs
Publication statusPublished - 2012 Jun 1

Fingerprint

failure analysis
Failure analysis
Actuators
Lead
actuators
Fabrication
fabrication
Silver
Capacitance
assembly
capacitance
silver
lead titanate zirconate
inversions
Defects
Networks (circuits)
defects

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Chen, Bing Liang ; Huang, Pao Cheng ; Jang, Ling-Sheng ; Chen, Ming Kun. / Electrical failure analysis of peristaltic micropumps fabricated with PZT actuators. In: Microelectronics Reliability. 2012 ; Vol. 52, No. 6. pp. 1080-1085.
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Electrical failure analysis of peristaltic micropumps fabricated with PZT actuators. / Chen, Bing Liang; Huang, Pao Cheng; Jang, Ling-Sheng; Chen, Ming Kun.

In: Microelectronics Reliability, Vol. 52, No. 6, 01.06.2012, p. 1080-1085.

Research output: Contribution to journalArticle

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