Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 °C

Po Cheng Shih, Kwang-Lung Lin

Research output: Contribution to journalArticlepeer-review

Abstract

Sn-8Zn-3Bi solder paste and Sn-3.2Ag-0.5Cu solder balls were reflowed simultaneously at 240 °C on Cu/Ni/Au metallized ball grid array substrates. The joints without Sn-Zn-Bi addition (only Sn-Ag-Cu) were studied as a control system. Electrical resistance was measured after multiple reflows and aging. The electrical resistance of the joint (R1) consisted of three parts: the solder bulk (Rsolder bulk, upper solder highly beyond the mask), interfacial solder/intermetallic compound (Rsolder/IMC) and the substrate (Rsubstrate). R1 increased with reflows and aging time. Rsolder/IMC), rather than Rsolder bulk and Rsubstrate, seemed to increase with reflows and aging time. The increase of R1 was ascribed to the Rsolder/IMC rises. Rsubstrate was the major contribution to R1. However Rsolder/IMC dominated the increase of R1 with reflows and aging. R1 of Sn-Zn-Bi/Sn-Ag-Cu samples were higher than that of Sn-Ag-Cu samples in various tests.

Original languageEnglish
Pages (from-to)113-123
Number of pages11
JournalJournal of Materials Research
Volume22
Issue number1
DOIs
Publication statusPublished - 2007 Jan 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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