Electrical tensile test

Hao Wen Hsueh, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

It is a tendency toward reducing diameter of bonding wires that could increase the counts of joints and reduced the volume. In the meantime, it would increases thermal stress and electrical current density. For this reason, a simple reliability analysis which included tension and electrical current was developed. Electrical tensile test is a robust and efficient scheme for dynamic reliability analysis. Compared to other reliability test, electrical tensile test could estimate tension and current density by one test. When electrical current, joule heat and tensile stress were applied simultaneously on a metal wire, the electrical tensile test was not to be compared to traditional tensile test. Both of tensile strength and elongation were decreased, few local grain growth and tensile-embrittlement was observed. In addition, the strength of wires was dropped 50% by higher electrical current density pass through that will reduce the reliability of the wire. Therefore, electrical tensile test is an efficiency dynamic reliability analysis method to avoid fracture happened.

Original languageEnglish
Title of host publication20th European Microelectronics and Packaging Conference and Exhibition
Subtitle of host publicationEnabling Technologies for a Better Life and Future, EMPC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9780956808622
Publication statusPublished - 2016 Jan 25
Event20th European Microelectronics and Packaging Conference and Exhibition, EMPC 2015 - Friedrichshafen, Germany
Duration: 2015 Sep 142015 Sep 16

Publication series

Name20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015

Other

Other20th European Microelectronics and Packaging Conference and Exhibition, EMPC 2015
CountryGermany
CityFriedrichshafen
Period15-09-1415-09-16

Fingerprint

Reliability analysis
Wire
Current density
Embrittlement
Grain growth
Thermal stress
Tensile stress
Elongation
Tensile strength
Metals

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Hsueh, H. W., Hung, F. Y., Lui, T. S., & Chen, L. H. (2016). Electrical tensile test. In 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015 [7390694] (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015). Institute of Electrical and Electronics Engineers Inc..
Hsueh, Hao Wen ; Hung, Fei Yi ; Lui, Truan Sheng ; Chen, Li Hui. / Electrical tensile test. 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 2016. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).
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Hsueh, HW, Hung, FY, Lui, TS & Chen, LH 2016, Electrical tensile test. in 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015., 7390694, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015, Institute of Electrical and Electronics Engineers Inc., 20th European Microelectronics and Packaging Conference and Exhibition, EMPC 2015, Friedrichshafen, Germany, 15-09-14.

Electrical tensile test. / Hsueh, Hao Wen; Hung, Fei Yi; Lui, Truan Sheng; Chen, Li Hui.

20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 2016. 7390694 (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Hsueh HW, Hung FY, Lui TS, Chen LH. Electrical tensile test. In 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc. 2016. 7390694. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).