Abstract
This study investigated the electro-dissolution, supersaturation and recrystallization of the second phase Bi in the Sn5Bi solder under 4.0×103-6.0×103 A/cm2 current stressing at 25 °C. The ex-situ XRD analysis of the current stressed specimen, after being quenched with liquid nitrogen, reveals a reduction of the Bi orientation peaks. The SEM investigation shows the dissolution and supersaturation of the Bi phase during current stressing. The in-situ SEM investigation reveals that recrystallization of the Bi phase occurred in the unquenched specimen when the current stopped. The kinetics of the electro-dissolution were analyzed, and the results showed that the maximum dissolution rate occurred during the progress of current stressing.
Original language | English |
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Pages (from-to) | 309-313 |
Number of pages | 5 |
Journal | Materials Letters |
Volume | 160 |
DOIs | |
Publication status | Published - 2015 Dec 1 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering